A method of operating an input/output interface includes selecting one of a plurality of output driver circuits according to a mode selection signal, and outputting a data signal using the selected one of the plurality of output driver circuits. Another method of operating an includes generating a mode selection signal based on a received command signal, and controlling an on-die termination (ODT) circuit included in the input/output interface according to the mode selection signal. Another method of operating an includes generating a mode selection signal based on a received command signal, and controlling an ODT circuit included in the input/output interface according to the mode selection signal.
|
17. An input/output interface circuit for a memory device comprising:
a mode selection circuit configured to generate a mode selection signal;
a termination circuit configured to provide the input/output interface with one of a vssq termination, a vddq termination and a termination off mode in response to the mode selection signal; and
an output driver block connected to an input/output pad including,
a first output driver circuit configured to transmit a output data signal, the first output driver circuit including a nmos pull-up driver;, and
a second output driver circuit configured to transmit the output data signal, the second output driver circuit including a pmos pull-up driver,
wherein one of the first output driver circuit and the second output driver circuit is selected to transmit the output data signal in response to the mode selection signal.
1. An input/output interface for a memory device comprising:
a mode selection circuit configured to generate a mode selection signal; and
an output driver block configured to be connected to an input/output pad and to transmit an output data signal, the input/output pad being terminated at the pad with one of a vssq termination, a vddq termination and a termination off mode based on the mode selection signal, and the output driver block comprising a plurality of output driver circuits, and one of the plurality of output driver circuits being configured to selectively operate or not operate during transmitting the output data signal based on the mode selection signal, wherein
each of the plurality of output driver circuits has different topology suitable for different operation speed, the operation speed selected from a group including a low speed operation, and a high speed operation faster than the low speed operation.
9. An input/output interface for a memory device comprising:
a mode selection circuit configured to generate a mode selection signal;
a termination circuit configured to provide the input/output interface with one of a vssq termination, a vddq termination and a termination off mode in response to the mode selection signal; and
an output driver block configured to transmit a data output signal, the output driver block being connected to an input/output pad and comprising a plurality of output driver circuits, wherein one of the plurality of output driver circuits is configured to selectively operate or not operate according to the mode selection signal, the mode selection signal indicating a termination type of the termination circuit,
wherein each of the plurality of output driver circuits has different topology suitable for different operation speed, the operation speed selected from a group including a low speed operation, and a high speed operation faster than the low speed operation.
2. The input/output interface of
3. The input/output interface of
4. The input/output interface of
5. The input/output interface of
6. The input/output interface of
7. The input/output interface of
8. The input/output interface of
10. The input/output interface of
11. The input/output interface of
12. The input/output interface of
13. The input/output interface of
14. The input/output interface of
15. The input/output interface of
16. The input/output interface of
18. The input/output interface of
19. The input/output interface of
20. The input/output interface of
21. The input/output interface of
|
100′the100a 100 and an electric-photo conversion circuit 1010. The electric-photo conversion circuit 1010 may convert an electrical signal output from the first memory device 100a 100 into a photo signal, and output the converted photo signal to the second system 1100 through optical connection means 901.
The second system 1100 includes a photoelectric conversion circuit 1120 and a second memory device 100b 100-2. The photoelectric conversion circuit 1120 may convert a photo signal input through the optical connection means 901 into an electric signal, and transmit the converted electrical signal to the second memory device 100b 100-2.
The first system 1000 may further include the photo-electric conversion circuit 1020, and the second system 1100 may further include the electric-photo conversion circuit 1110.
When the second system 1100 transmits data to the first system 1000, the electric-photo conversion circuit 1110 may convert an electrical signal output from the second memory device 100b 100-2 into a photo signal, and output the converted photo signal to the first system through the optical connection means 901. The photoelectric conversion circuit 1020 may convert a photo signal input through the optical connection means 901 into an electric signal, and transmit the converted electrical signal to the first memory device 100a 100. A structure and an operation of each memory device 100a 100 and 100b 100-2 are substantially the same as a structure and an operation of the memory device 100 of
A method according to an example embodiment of the inventive concepts, by selecting and using an output driver circuit or an input receiver circuit according to an operation mode, may embody an appropriate input/output interface in the operation mode.
The method according to an example embodiment of the inventive concepts, by selecting and using the appropriate output driver circuit or an input receiver circuit in an operation mode, may improve efficiency in electricity and maintain good property of a transmission signal.
Although a some example embodiments of the inventive concepts have been shown and described, it will be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the inventive concepts, the scope of which is defined in the appended claims and their equivalents.
Cho, Young Chul, Lee, Jung Bae, Choi, Jung Hwan
Patent | Priority | Assignee | Title |
Patent | Priority | Assignee | Title |
5705937, | Feb 23 1996 | MORGAN STANLEY SENIOR FUNDING, INC | Apparatus for programmable dynamic termination |
5751978, | Nov 13 1995 | PROGRESSIVE SEMICONDUCTOR SOLUTIONS LLC | Multi-purpose peripheral bus driver apparatus and method |
5949252, | Jul 03 1996 | SOCIONEXT INC | Bus configuration and input/output buffer |
6208168, | Jun 27 1997 | Samsung Electronics Co., Ltd. | Output driver circuits having programmable pull-up and pull-down capability for driving variable loads |
6542946, | Jan 28 2000 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Dual mode differential transceiver for a universal serial bus |
6642740, | Sep 15 2000 | Samsung Electronics Co., Ltd. | Programmable termination circuit and method |
7034565, | Nov 20 2002 | Samsung Electronics Co., Ltd. | On-die termination circuit and method for reducing on-chip DC current, and memory system including memory device having the same |
7372294, | Sep 29 2005 | CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC | On-die termination apparatus |
7408378, | Dec 19 2003 | Rambus Inc. | Calibration methods and circuits for optimized on-die termination |
7612579, | Aug 29 2006 | Longitude Licensing Limited | Output circuit of semiconductor device and semiconductor device including thereof |
7626417, | Dec 12 2007 | Hynix Semiconductor Inc. | On-die-termination control circuit and method |
7671622, | Dec 12 2007 | Hynix Semiconductor Inc. | On-die-termination control circuit and method |
7741867, | Oct 30 2008 | Hewlett Packard Enterprise Development LP | Differential on-line termination |
8008944, | Nov 25 2008 | Qualcomm Incorporated | Low voltage differential signaling driver with programmable on-chip resistor termination |
8035413, | Jun 08 2007 | Mosaid Technologies Incorporated | Dynamic impedance control for input/output buffers |
8242796, | Feb 21 2008 | Advantest Corporation | Transmit/receive unit, and methods and apparatus for transmitting signals between transmit/receive units |
20060044008, | |||
20060158214, | |||
20060255830, | |||
20070070717, | |||
20070126466, | |||
20070222476, | |||
20080030221, | |||
20080054936, | |||
20080164904, | |||
20080284465, | |||
20090237109, | |||
20100097094, | |||
20100208534, | |||
20100259294, | |||
20100302893, | |||
20110280322, | |||
20120146687, | |||
20120254663, | |||
20130069689, | |||
20140028345, | |||
JP2813103, | |||
JP4061489, | |||
KR101161740, | |||
KR20030090955, | |||
KR20070036473, | |||
KR20090108800, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Apr 02 2020 | Samsung Electronics Co., Ltd. | (assignment on the face of the patent) | / |
Date | Maintenance Fee Events |
Apr 02 2020 | BIG: Entity status set to Undiscounted (note the period is included in the code). |
Date | Maintenance Schedule |
Apr 25 2026 | 4 years fee payment window open |
Oct 25 2026 | 6 months grace period start (w surcharge) |
Apr 25 2027 | patent expiry (for year 4) |
Apr 25 2029 | 2 years to revive unintentionally abandoned end. (for year 4) |
Apr 25 2030 | 8 years fee payment window open |
Oct 25 2030 | 6 months grace period start (w surcharge) |
Apr 25 2031 | patent expiry (for year 8) |
Apr 25 2033 | 2 years to revive unintentionally abandoned end. (for year 8) |
Apr 25 2034 | 12 years fee payment window open |
Oct 25 2034 | 6 months grace period start (w surcharge) |
Apr 25 2035 | patent expiry (for year 12) |
Apr 25 2037 | 2 years to revive unintentionally abandoned end. (for year 12) |