Discussed is a flexible display device to reduce a width of a bezel. The flexible display device includes a substrate being formed of a flexible material, a plurality of gate lines and a plurality of data lines crossing each other, a plurality of pads formed in a pad area of a non-display area, a plurality of links formed in a link area of the non-display area a plurality of insulation films formed over the entire surface of the substrate, and a first bending hole formed in a bending area of the non-display area, the first bending hole passing through at least one of the insulation films disposed under the link, wherein the bending area is bent such that the pads are disposed on the lower surface of the substrate.
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0. 9. A display device comprising:
a flexible substrate including a display area, a pad area, and a bending area between the display area and the pad area;
a plurality of insulation films including a buffer film, a gate insulation layer and an interlayer insulation film, which are sequentially formed on the flexible substrate, at least one first hole passing through at least one of the buffer film, the gate insulation film and the interlayer insulation film in the bending area;
a plurality of link lines crossing the bending area on the interlayer insulating film, each of the link lines including a portion disposed above the at least one first hole in the bending area, wherein at least a portion of the at least one first hole is provided between two adjacent link lines in the bending area;
a plurality of gate lines and a plurality of data lines formed on the flexible substrate;
a plurality of thin film transistors formed at intersections between the gate lines and the data lines; and
a plurality of pads formed in the pad area, each pad electrically connected with one of the gate or data lines.
0. 1. A method for manufacturing a flexible display device comprising:
forming a substrate defined by a display area and a non-display area being an outer region of the display area and including a link area and a pad area, using a flexible material;
forming a buffer film over the surface of the substrate;
forming a gate insulation film over the surface of the buffer film;
forming gate lines in the display area on the gate insulation film;
forming an interlayer insulation film over the entire surface of the gate insulation film such that the interlayer insulation film covers the gate lines;
forming a first bending hole passing through at least the gate insulation film and the interlayer insulation film in a bending area, wherein the bending area bends such that the pad area of the non-display area is disposed on the lower surface of the substrate;
forming data lines and a plurality of links, wherein the data lines are formed in the display area on the interlayer insulation film such that the data lines cross the gate lines, and wherein the plurality of links are connected to signal lines selected from the gate lines and the data lines in the linking area on the interlayer insulation film;
forming a protective film over the surface of the interlayer insulation film such that the protective film covers the data lines and the links;
forming a plurality of pads connected to the links and connected to an exterior circuit to supply a driving signal to the signal line on the protective film; and
bending the bending area such that the pads are disposed on the back side of the surface of the substrate.
0. 2. The method according to
wherein the first bending hole further passes through the buffer film to expose at least a part of the anti-etching layer, during formation of the first bending hole, and
the link directly contacts at least a part of the anti-etching layer exposed through the first bending hole in the bending area, during formation of the link.
0. 3. The method according to
0. 4. The method according to
the first bending hole is further formed in the pad area during formation of the first bending hole.
0. 5. The method according to
0. 6. The method according to
0. 7. The method according to
the first bending hole includes a plurality of first bending holes to expose at least a part of the respective anti-etching patterns during formation of the first bending hole, and
The links contact the anti-etching patterns exposed through the first bending holes, respectively, during formation of the data lines and the links.
0. 8. The method according to
forming an anti-etching layer in the bending area of the non-display area on the substrate, before formation of the buffer film; and
forming a pre-bending hole passing through the buffer film in the bending area such that the pre-bending hole exposes at least a part of the anti-etching layer, after formation of the buffer film.
wherein the first bending hole passes through the gate insulation film and the interlayer insulation film in the pre-bending hole, in a width smaller than the pre-bending the hole to expose the anti-etching layer, during formation of the first bending hole, and
the link directly contacts at least a part of the anti-etching layer exposed through the pre-bending hole and the first bending hole in the bending area, during formation of the link.
0. 10. The display device according to claim 9, wherein the link lines are formed in a link area of the flexible substrate,
wherein the link lines connect the respective pads to the gate and data lines on the flexible substrate, and
wherein the bending area and the link area overlap with each other.
0. 11. The display device according to claim 10, wherein the bending area is wider than the link area.
0. 12. The display device according to claim 10, wherein the link area is wider than the bending area.
0. 13. The display device according to claim 9. wherein the link lines are disposed in the bending area and in a link area of the flexible substrate.
0. 14. The display device according to claim 9, further comprising:
at least one second hole formed within the at least one first hole,
the at least one second hole being located at a periphery area of one of the link lines, and passing through a part of one of the insulation films.
0. 15. The display device according to claim 14, wherein the at least one second hole exposes an upper surface of the flexible substrate in the bending area.
0. 16. The display device according to claim 14, further comprising:
a protective film covering the link lines,
wherein the at least one second hole passes through the protective film.
0. 17. The display device according to claim 16, further comprising:
an active layer formed in a part of a pixel area on the buffer film;
a gate electrode formed on the gate insulation layer,
source and drain electrodes on the interlayer insulation film;
a first electrode on the protective film;
a light emitting layer on the first electrode; and
a second electrode on the light emitting layer.
0. 18. The display device according to claim 17, further comprising:
a sealing layer on the second electrode in the display area.
0. 19. The display device according to claim 17, further comprising:
a bank formed on a periphery of the pixel area on the protective film to overlap at least a part of an edge of the first electrode.
0. 20. The display device according to claim 14, wherein for a pixel area in the display area, a corresponding gate line is formed on a gate insulation layer together with a gate electrode, and a corresponding link line is connected to the corresponding gate line through a link hole which passes through an interlayer insulation film to expose at least a part of the corresponding gate line.
0. 21. The display device according to claim 20, further comprising:
a pad connected to the corresponding link line through a pad hole.
0. 22. The display device according to claim 21, wherein the at least one first hole or the at least one second hole is disposed between the link hole and the pad hole.
0. 23. The display device according to claim 22 wherein a length of one of the link lines is longer than a distance between the link hole and the pad hole.
0. 24. The display device according to claim 9, further comprising:
an anti-etching layer formed between the flexible substrate and the insulation films in the bending area,
wherein a part of the anti-etching layer is exposed by the at least one first hole, and
wherein one of the link lines contacts the exposed part of the anti-etching layer in the bending area.
0. 25. The display device according to claim 14, further comprising:
an anti-etching layer formed between the flexible substrate and the insulation films in the bending area,
wherein a part of the anti-etching layer is exposed by the at least one first hole,
wherein one of the link lines contacts the exposed part of the anti-etching layer in the bending area, and
wherein the at least one second hole passes through the anti-etching layer.
0. 26. The display device according to claim 9, wherein a width of each of the at least one first hole is wider than a width of each of the link lines.
0. 27. The display device according to claim 9, further comprising:
a protective film formed on the flexible substrate,
wherein the protective film fills the at least one first hole in the bending area.
0. 28. The display device according to claim 9, wherein the bending area is bent such that the pad area including the pads is provided under the display area of the flexible substrate.
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This application is a 106 105 and the anti-etching layer 106 in the periphery of the link LK in the first bending hole BH1 to expose a part of the substrate 101.
As a result, when the protective film 105 and the anti-etching layer 106 are removed by formation of the second bending hole BH2 in a portion of the bending area BA, excluding the periphery of the link LK, bending stress factors are further reduced and defects caused by bending stress can thus be further prevented.
Next, the third embodiment of the present invention will be described with reference to
As shown in
Forming the pre-bending hole pre_BH1 shown in
Next, the flexible display device according to the fourth embodiment of the present invention will be described with reference to
As shown in
Next, a method for manufacturing the flexible display device according to the first embodiment of the present invention will be described with reference to
The method further includes: forming, at step S140, (1) gate lines GL and data lines DL on the buffer film 102 in the display area AA; (2) a plurality of insulation films on the entire surface of the buffer film 102; (3) a first bending hole BH1 in the bending area BA of the non-display area NA1; (4) a plurality of pads PD in the pad area FDA of the nondisplay area NA1; and (5) a plurality of links LK in the link area of the non-display area NA1,
At the above step S140, the first bending hole is configured to passes through at least one of a plurality of insulation films in the bending area of the non-display area. The bending area is configured to be bent such that the pad area is disposed on the lower surface of the substrate. The plurality of pads is configured to be connected to an exterior circuit to supply a driving signal to any one signal line of the gate line and the data line. The plurality of links is configured to connect respective pads with the signal lines.
The method further includes: forming, at step S150, a light emitting array including a plurality of light emitting elements EL in respective pixel areas PA; forming, at step S160, a sealing layer 130 in the display area AA. The sealing layer 130 seals the light emitting elements EL such that the sealing layer 130 faces the substrate 101 via the light emitting elements EL; and bending, at step S170, a bending area BA such that the pads PD are disposed on the lower surface of the substrate 101.
The anti-etching layer 106 may be formed in the entirety of the non-display area NA, or only in at least one of selected side area of the non-display area NA, including the later-formed first bending hole (Bill of
The anti-etching layer 106 includes the bending area BA and is thus bent together with the substrate 101. Although the etching process to form the first bending hole BH1 is performed under over-etching conditions, it is necessary to prevent exposure of the substrate during etching and generation of foreign matter caused by the anti-etching layer 106. Accordingly, a material for the anti-etching layer 106 may be selected from materials having a higher softness in other words, lower hardness) and a lower etch ratio than each of inorganic insulating materials for at least one of the later-formed buffer film 102, gate insulation film 103 and interlayer insulation film 104.
For example, a material for the anti-etching layer 106 is selected from ITO, Mo, Ti and a-Si which are advantageous in terms of process cost, easiness and universality.
Furthermore, because the plurality of links (LK of
Then, a gate electrode 113 overlapping at least a part of a channel area of the active layer 111 and gate lines (not shown, but corresponding to GL of
The source hole SH passes through the interlayer insulation film 104 and the gate insulation film 103 to expose at least a part of the source region 111b.
The drain hole DH passes through the interlayer insulation film 104 and the gate insulation film 103 to expose at least a part of the drain region 111c.
The link hole LKH functions as a contact hole to connect the gate line GL and the links LK disposed in a layer different from the gate line GL and passes through the interlayer insulation film 104 and the gate insulation film 103 to expose at least a part of the gate line GL.
The first bending hole BH1 functions to prevent generation of cracks caused by application of greater bending stress to the buffer film 102, the gate insulation film 103 and the interlayer insulation film 104, as compared to stress applied to the substrate 101, when the bending area BA is bent. The first bending hole BH1 passes through the buffer film 102, the gate insulation film 103 and the interlayer insulation film 104, and exposes at least a part of the anti-etching layer 106 in the bending area BA.
The source electrode 114a is connected to the source region 111b of the active layer 111 through the source hole SH, and the drain electrode 114b is connected to the drain region 111c of the active layer 111 through the drain hole DH.
Some links LK corresponding to the gate lines GL are connected to the gate line GL, through the link hole LKH, and other links LK corresponding to the data lines DL are configured to be extended from the data line DL.
In addition, the links LK directly contact the anti-etching layer 106 through the first bending hole BH1 in the bending area BA.
When the anti-etching layer 106 is a conductive material, the links LK contact a plurality of anti-etching patterns (corresponding to 106a and 106b of
Although not illustrated, a method for the flexible display device according to the fourth embodiment of the present invention (corresponding to
As shown in
Meanwhile, although not illustrated in
A method for manufacturing the flexible display device according to the second embodiment will be described with reference to
As shown in
Referring to
The further addition of the second bending hole BH2 enables further removal of the protective film 105 and the anti-etching layer 106 disposed in the periphery of the link LK in the bending area BA, further reduction of the bending stress factor and improvement in reliability and yield of the flexible display device.
Next, referring to
As shown in
As shown in
When the method further includes the pre-bending hole pre_BH1 (S1400), at the step of forming of the source hole SH, the drain hole DH, the link hole LKH and the first bending hole BH1 (S145), the etching of the buffer film 102 which has been carried out only for formation of the first bending hole BH1 becomes unnecessary, consequently, it is possible to prevent the source hole SH, the drain hole DH, and the link hole LKH from being excessively etched while the buffer film 102 is completely patterned to form the first bending hole BH1. As a result, it is possible to reduce damage to the source region 111b, the drain region 111c and the gate line GL by the source hole SH, the drain hole DH and the link hole LKH, respectively.
The flexible display device according to the embodiments of the present invention can reduce a width of a bezel without reducing a width of the non-display area, since the plurality of pads are disposed on the lower surface of the substrate by bending the bending area. Accordingly, the display devices have improved product values associated with aesthetics and usability.
The flexible display device includes the first bending hole, thus enabling removal of parts of each the buffer film, the gate insulation film and the interlayer insulation film which correspond to the bending area. As a result, it is possible to prevent problems such as application of relatively greater bending stress to the buffer film, the gate insulation film and the interlayer sulation film than bending stress to the substrate, when the bending area is bent, generation of cracks and thus breakage (disconnection) of links (wiring). As a result, it is possible to improve reliability and yield of the display device.
In addition, the flexible display device fluffier includes an anti-etching layer between the substrate and the buffer film in a part of the non-display area, that is, in a region including the first bending hole, thus preventing the substrate from being etched by an etching process to form the first bending hole. As a result, it is possible to prevent permeation of foreign matter causing defects and thereby improve reliability and yield of the display device.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventions. Thus, it is intended that the present invention covers the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.
Youn, Sang-Cheon, Jin, Hyoung-Suk, Kang, Chang-Heon, Kwon, Se-Yeoul
Patent | Priority | Assignee | Title |
Patent | Priority | Assignee | Title |
6486544, | Sep 09 1998 | Seiko Epson Corporation | Semiconductor device and method manufacturing the same, circuit board, and electronic instrument |
20020067456, | |||
20040207569, | |||
20050078446, | |||
20050078459, | |||
20050253773, | |||
20070035473, | |||
20070229751, | |||
20080062373, | |||
20110007042, | |||
20120146886, | |||
20130002583, | |||
20130119368, | |||
20140042406, | |||
20140097408, | |||
20140240985, | |||
CN1507009, | |||
CN1607895, | |||
EP2073054, | |||
GB2396244, | |||
JP2002131773, | |||
JP2005123622, | |||
JP201134066, | |||
JP2012128006, | |||
JP2012174473, | |||
JP201315836, | |||
JP6194680, | |||
KR1020010031776, | |||
WO2006129223, |
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