An electrical contact for use in a connector between mutually opposed electrical interfaces comprises a generally planar contact body having first and second major faces. The body includes a pair of spaced apart spring arms connected by a resilient bight. The spring arms have respective free ends each with an outwardly facing edge which defines a contact nose engageable with a respective one of the interfaces. Respective shorting sections extend from each of the free ends generally toward each other. The shorting sections are offset from each other such that the first major face of one shorting section is coplanar with the second major face of the other shorting section. Upon deflection of the spring arms relatively closer together, the coplanar major faces of the shorting sections come into mutual engagement, whereby a shortened electrical path is formed between the contact noses.

Patent
   5653598
Priority
Aug 31 1995
Filed
Aug 31 1995
Issued
Aug 05 1997
Expiry
Aug 31 2015
Assg.orig
Entity
Large
95
17
all paid
1. An electrical contact for use in a connector between mutually opposed electrical interfaces, comprising:
a generally planar contact body having first and second major faces, the body including a pair of spaced apart spring arms connected by a resilient bight portion, the spring arms having respective free ends each with an outwardly facing edge which defines a contact nose engageable with a respective one of the interfaces, and that respective shorting sections extending from each of the free ends generally toward each other and being offset such that, upon deflection of the spring arms relatively closer together, the shorting sections overlap and the first major face of one shorting section engages the second major face of the other shorting section, whereby a shortened electrical path is formed between the contact noses while the spring arms, the bight portion, and the shorting section lie in a common plane.
5. An electrical contact for use in a connector between mutually opposed electrical interfaces, comprising:
a generally planar contact body stamped from sheet material, the body having first and second major faces corresponding to opposite side surfaces of the sheet material, the body including a resilient bight portion and a pair of spaced apart spring arms extending from the bight portion, the spring arms having respective free ends each with an outwardly facing edge which defines a contact nose engageable with a respective one of the interfaces, and respective shorting sections extending from each of the free ends generally toward each other and being offset such that the first major face of one shorting section is substantially coplanar with the second major face of the other shorting section, whereby upon deflection of the spring arms relatively closer together, the substantially coplanar major faces of the respective shorting sections come into mutual engagement, while the spring arms, the bight portion, and the shorting sections lie in a common plane so as to form a shortened electrical path is formed between the contact noses.
2. The contact according to claim 1, wherein the bight portion is an arcuate section of the contact body.
3. The contact according to claim 1, wherein the bight portion is bisected by a central axis of the contact body.
4. The contact according to claim 1, wherein the spring arms angularly diverge as they extend from the bight portion.
6. The contact according to claim 5, wherein the bight portion is an arcuate section of the contact body.
7. The contact according to claim 5, wherein the bight portion is bisected by a central axis of the contact body.
8. The contact according to claim 5, wherein the spring arms angularly diverge as they extend from the bight portion.

The invention relates to a very thin electrical contact which has shorting sections engageable with each other for reducing self-inductance effects in the contact.

Electronic packages having leads arranged in a ball grid array (BGA) or a land grid array (LGA) are known. These packages have a relatively low height which is desirable for saving space in electronic assemblies. The packages may be surface mounted directly on a circuit board in a soldering process wherein the leads become solder bonded to a corresponding array of circuit pads on the board. However, solder bonding has the drawback that the package is not easily removable for replacement or upgrade. It is often desirable to provide a connector for mounting the electronic package on the circuit board in a separable fashion.

Connectors are known for removably mounting a BGA or LGA package on a circuit board. Such connectors are disclosed in U.S. Pat. No. 4,511,197; 4,513,353; 4,647,124; and 4,699,593. These connectors comprise a substantially flat dielectric housing which resides between the electronic package and the circuit board. The housing has an array of cavities in which are disposed electrical contacts arranged in correspondence with the array of leads of the electronic package. Each of the contacts has a pair of oppositely extending noses which project beyond external surfaces of the connector housing. When the package is mounted on the connector, each of the contacts has one nose engaged with a respective lead of the package and the other nose engaged with a respective pad on the board. A compressive force is applied to the package and the board to assure firm engagement of each nose with its respective lead or pad. Typically, the compressive force may be applied by pressure plates which are fastened together to sandwich the package, connector and board therebetween.

In packaging electronic components, consideration must be given to horizontal and vertical space limitations, and the nature of the assembly often dictates parameters on the space limitations. For example, in packaging lap top computers, vertical space is much more valuable than horizontal space. Design requirements for a future laptop computer call for a connector only 0.032 inch high and a working range of 0.015 inch. The working range is a very large percentage of the total connector height, thus making the contact design quite difficult. Accordingly, it is an object of the invention to provide a contact having a low overall height and a large working range.

Further, modern electrical equipment may operate at very high switching frequencies, and this can give rise to significant self-inductance effects which may interfere with proper operation of the equipment. Self-inductance effects can be reduced by reducing the length of the circuit path through the contact. However, it is desirable for the contact to have a relatively long spring arm to provide compliance which is necessary to permit deflection of the contact without plastic deformation. In order to overcome the problem posed by these competing interests, contacts have been developed with spring arms for compliancy and a shorting arm which interconnects free ends of the spring arms to provide a shorter current path through the contact. One such contact is disclosed in U.S. Pat. No. 4,354,729, wherein a shorting arm 68 has a side edge in sliding engagement with side edge 79 of latch arm 54. Contacts such as this are becoming increasingly miniaturized, and as the thickness of the contact is decreased, it becomes increasingly difficult to mate the side edges of arms 68 and 74. Accordingly, it is an object of the invention to lower the self-inductance effect in a contact made from very thin material.

An electrical contact for use in a connector between mutually opposed electrical interfaces comprises a generally planar contact body having first and second major faces. The body includes a pair of spaced apart spring arms connected by a resilient bight portion. The spring arms have respective free ends each with an outwardly facing edge which defines a contact nose engageable with a respective one of the interfaces. Respective shorting sections extend from each of the free ends generally toward each other. The shorting sections are offset such that, upon deflection of the spring arms relatively closer together, the shorting sections overlap and the first major face of one shorting section engages the second major face of the other shorting section, whereby a shortened electrical path is formed between the contact noses.

The invention will now be described by way of example with reference to the accompanying drawings in which like elements in different figures thereof are identified by the same reference numeral and wherein:

FIGS. 1 and 2 are isometric views of a contact according to the invention from opposite sides.

FIG. 3 is a side view of the contact.

FIG. 4 is a top view of a portion of a connector having cavities which can receive the contact.

FIG. 5 is an enlarged view of an empty cavity in the connector.

FIG. 6 is an enlarged view of a cavity with a contact therein.

FIG. 7 is a cross-sectional view of the contact in undeflected condition in a connector between electrical interfaces.

FIG. 8 is a cross-sectional view taken along line 8--8 of FIG. 7.

FIG. 9 is a cross-sectional view of the contact in deflected condition in a connector between electrical interfaces.

FIG. 10 is a cross-sectional view taken along line 10--10 of FIG. 9.

With reference to FIGS. 1-3, a contact according to the invention is preferably stamped from sheet material to form a generally planar contact body 10 having first and second major faces 11, 12 corresponding to surfaces of the material from which it is stamped, with a thickness T of approximately 0.0045 inch. The contact body 10 includes a pair of spring arms 14, 15 which are connected at one end by a resilient bight portion 16. The bight portion 16 is preferably an arcuate section which enhances flexibility in the plane of the contact body, although the bight portion 16 may be defined more sharply by an intersection of the arms 14, 15 at an acute angle. In the preferred embodiment the bight portion 16 is bisected by central axis A of the contact.

The arms 14, 15 are spaced apart at some dimension when the contact is in an undeflected state. Preferably, the arms angularly diverge as they extend from the bight portion 16, although the arms may be parallel to each other. The arms also extend slightly out of the plane of the contact body as they extend away from the bight portion. The arms have respective free ends with outwardly facing edges defining a pair of oppositely facing contact noses 17, 18 each engageable with a respective ball or pad of a circuit element. Respective shorting sections 19, 20 extend from each of the free ends generally toward each other. The shorting sections are offset slightly from each other due to the arms extending slightly out of the plane of the contact body for reasons that will be more fully explained hereinafter.

The contact is useful in a connector for electrically connecting a first electrical interface, such as leads of an electronic package, to a second electrical interface, such as circuit paths on a circuit board. There is shown in FIG. 4 a top view of a portion of such a connector which includes a connector body 30 made from plastic or other dielectric material having a plurality of contact cavities 32. The cavities 32 are arranged in an array corresponding to the array of leads of the electronic package to be mounted on the connector. Each of the cavities 32 is an elongated slot which extends through the connector body from top to bottom thereof. As shown more clearly in FIGS. 5 and 6, each of the cavities 32 has a contact retention section 33 defined by opposed surfaces 34, 35 which are spaced apart at a dimension selected to produce a slight interference fit with the contact body near the bight portion when the contact is disposed therein.

FIGS. 7 and 8 show cross-sectional views of a representative contact 10 in undeflected condition in a connector 30 which serves to electrically connect an electronic package 2 to a circuit board 6. The package has electrical leads each in the form of a contact pad 4, the leads being disposed in a standardized array over a face of the package. Instead of contact pads, the package could have an array of solder balls, the contact of the present invention being engageable with either ball or pad type leads. The circuit board 6 has an array of contact pads 8 corresponding to the array of pads 4 of the package. The noses 17, 18 of the contact are engaged by the pads 4, 8 when the package 2 is urged against the connector 30. The package may be urged against the connector such as by pressure plates (not shown) arranged above the package and below the circuit board and secured together with threaded fasteners, thereby sandwiching the package, the connector and the circuit board therebetween.

As best seen in FIG. 8, the first major face 11 of the shorting section 19 is substantially coplanar with the second major face 12 of the shorting section 20. Thus, the shorting sections are poised for mutual engagement along their respective major faces upon deflection of the contact.

When the connector is clamped between the package and the board, the contact is compressed to the deflected condition shown in FIGS. 9 and 10, thereby deflecting the spring arms 14, 15 to a position where they are relatively closer together. In this position the shorting sections 19, 20 overlap and, as best seen in FIG. 10, the first major face 11 of the shorting section 19 engages the second major face 12 of the other shorting section 20, thereby producing a short and direct electrical path between the contact noses 17, 18. The shorter electrical path has lower electrical resistance than the longer path which extends through both of the spring arms 14, 15. Current flow will favor the lower resistance path, of course, and the shorter path results in a reduced self-inductance effect when compared to the longer path through the spring arms. By engaging the shorting sections along their major faces instead of their side edges, the problem of aligning and mutually engaging very thin side edges, such as those having a thickness of 0.0045 inch, is avoided.

As the contact is compressed, the noses 17, 18 exert a slight wiping action along the pads 4, 8 due to changing angularity between the arms 14, 15. This wiping action serves to clean the pads 4, 8 by rubbing away dirt and oxides which may have accumulated.

A contact according to the invention is preferably made of a spring temper alloy in which a substantial portion consists of precious metals, such as palladium, gold, or silver, as well as nickel and other non-precious metals. A consideration in material selection, in addition to spring characteristics, is the ability of the contact to mate with a solder lead without transfer of tin from the solder lead to the contact. Of the non-noble metals, beryllium-nickel alloy meets that requirement, as do the above-listed precious metals. Since these materials are quite expensive, efficient material utilization is an important factor in deciding on the shape of the spring contact. The invention contributes to efficient material utilization because a very dense arrangement of the contacts can be patterned on a material strip, thereby minimizing material scrap which is leftover after contact stamping.

A contact according to the invention has several advantages. The contact can be made very small yet it has high compliancy which results in a working range which is approximately fifty percent of its undeflected height. The contact has shorting sections which reduce self-inductance effects. The shorting sections engage along their major faces, thereby avoiding the difficulty of aligning very thin side edges for mutual engagement. Also, the shape of the contact minimizes material scrap during manufacture.

The invention having been disclosed, a number of variations will now become apparent to those skilled in the art. Whereas the invention is intended to encompass the foregoing preferred embodiments as well as a reasonable range of equivalents, reference should be made to the appended claims rather than the foregoing discussion of examples, in order to assess the scope of the invention in which exclusive rights are claimed.

Grabbe, Dimitry G.

Patent Priority Assignee Title
10403992, Mar 30 2018 TE Connectivity Solutions GmbH Socket assembly for an electrical system
10998662, Apr 12 2019 Lotes Co., Ltd Electrical connector
11211728, Jan 14 2019 Amphenol Corporation Midboard cable terminology assembly
11223152, Feb 22 2019 Amphenol InterCon Systems, Inc.; AMPHENOL INTERCON SYSTEMS, INC Interposer assembly and method
11404811, Jan 14 2019 Amphenol Corporation Small form factor interposer
11476619, Jul 20 2018 FCI USA LLC High frequency connector with kick-out
11670879, Jan 28 2020 FCI USA LLC High frequency midboard connector
11862883, Jul 16 2021 Lotes Co., Ltd Electrical connector having conductive terminals with high density and low height
12149027, Jul 20 2018 FCI USA LLC High frequency connector with kick-out
5913700, Jul 14 1997 WHITAKER CORPORATION, THE Card edge connector having low inductance contact system
5984693, Dec 17 1998 Hon Hai Precision Ind. Co., Ltd. Contact of an LGA socket
6077089, Jan 19 1999 AVX Corporation Low profile electrical connector
6083022, Oct 15 1997 Hon Hai Precision Ind. Co., Ltd. System for connecting daughter and mother boards
6132220, Aug 11 1999 Hon Hai Precision Ind. Co., Ltd. Land grid array socket
6146152, Sep 29 1999 Hon Hai Precision Ind. Co., Ltd. Land grid array connector
6164978, Oct 08 1999 Hon Hai Precision Ind. Co., Ltd. Land grid array connector
6176707, Apr 07 1999 Amphenol Corporation Interposer assembly
6179624, Nov 05 1999 Hon Hai Precision Ind. Co., Ltd. Land grid array connector
6200141, Aug 19 1997 Aries Electronics, Inc. Land grid array connector
6203331, Nov 05 1999 Hon Hai Precision Ind. Co., Ltd. Land grid array connector having a floating housing
6210176, Nov 18 1999 Hon Hai Precision Ind. Co., Ltd. Land grid array connector
6217342, Oct 30 1997 Amphenol Corporation Interposer assembly
6227869, Nov 24 1998 Hon Hai Precision Ind. Co., Ltd. Terminal for an LGA socket
6257899, Jul 26 2000 Hon Hai Precision Ind. Co., Ltd. Soft internal touch contact for IC socket
6257905, Nov 30 1998 Hewlett Packard Enterprise Development LP Surface mounted contact block
6264476, Dec 09 1999 High Connection Density, Inc. Wire segment based interposer for high frequency electrical connection
6273731, Jan 19 1999 AVX Corporation Low profile electrical connector
6290507, Oct 30 1997 Amphenol Corporation Interposer assembly
6296495, Nov 05 1999 Hon Hai Precision Ind. Co., Ltd. Land grid package connector
6315576, Oct 30 1997 Amphenol Corporation Interposer assembly
6375474, Aug 09 1999 Berg Technology, Inc. Mezzanine style electrical connector
6409521, May 06 1997 R&D Sockets, Inc Multi-mode compliant connector and replaceable chip module utilizing the same
6456504, Oct 31 2000 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Surface mounted grounding clip for shielded enclosures
6572396, Feb 02 1999 Gryphics, Inc. Low or zero insertion force connector for printed circuit boards and electrical devices
6579104, Jan 19 1999 AVX Corporation Low profile electrical connector
6585535, Jan 09 2001 Tyco Electronics Corporation Electrical contact for LGA and BGA electrical packages
6604950, Apr 26 2001 Teledyne Technologies Incorporated Low pitch, high density connector
6650546, Feb 27 2001 Hewlett Packard Enterprise Development LP Chip component assembly
6731516, Mar 21 2003 Hon Hai Precision Ind. Co., Ltd. Land grid array connector having movable engagement of electrical contacts thereinto
6758702, Feb 24 2000 Berg Technology, Inc Electrical connector with compression contacts
6830460, Aug 02 1999 R&D Sockets, Inc Controlled compliance fine pitch interconnect
6830461, May 16 2001 TYCO ELECTRONICS JAPAN G K Electrical contact and electrical connection device using same
6843659, Nov 22 2002 Hon Hai Precision Ind. Co., Ltd. Electrical connector having terminals with reinforced interference portions
6851954, Jul 30 2002 AVX Corporation Electrical connectors and electrical components
6860741, Jul 30 2002 AVX Corporation Apparatus and methods for retaining and placing electrical components
6906404, May 16 2003 Siemens VDO Automotive Corporation Power module with voltage overshoot limiting
6913468, Nov 16 1993 FormFactor, Inc. Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods
6921270, Jun 11 2003 CINCH CONNECTORS, INC Electrical connector
6928727, Jul 30 2002 AVX Corporation Apparatus and method for making electrical connectors
6939143, Jan 20 2000 R&D Sockets, Inc Flexible compliant interconnect assembly
6945788, Jul 31 2003 TE Connectivity Solutions GmbH Metal contact LGA socket
6957963, Jan 20 2000 R&D Sockets, Inc Compliant interconnect assembly
6987670, May 16 2003 Continental Automotive Systems, Inc Dual power module power system architecture
6994565, Jul 14 2003 FCI Americas Technology, Inc. Electrical contact assembly with insulative carrier, stapled contact attachment and fusible element
7014479, Mar 24 2003 BeCe Pte Ltd Electrical contact and connector and method of manufacture
7029288, Mar 24 2003 BeCe Pte Ltd Electrical contact and connector and method of manufacture
7029289, Mar 24 2003 BeCe Pte Ltd Interconnection device and system
7040902, Mar 24 2003 BeCe Pte Ltd Electrical contact
7052284, Apr 16 2004 Hon Hai Precision Ind. Co., Ltd. Electrical contact having shorting member with reduced self-inductance
7094062, Jul 24 2003 Molex Incorporated Land grid array connector
7094066, Jun 11 2003 Cinch Connectors, Inc. Electrical connector
7114960, Jan 20 2000 R&D Sockets, Inc Compliant interconnect assembly
7121839, Jan 20 2000 R&D Sockets, Inc Compliant interconnect assembly
7160115, Aug 02 2004 Hon Hai Precision Ind. Co., Ltd.; HON HAI PRECISION IND CO , LTD Contact module with connectors
7160119, Aug 02 1999 R&D Sockets, Inc Controlled compliance fine pitch electrical interconnect
7180763, Sep 21 2004 Continental Automotive Systems, Inc Power converter
7186119, Oct 17 2003 INTEGRATED SYSTEMS TECHNOLOGIES, LLC Interconnection device
7214069, Jul 07 2003 R&D Sockets, Inc Normally closed zero insertion force connector
7261567, Jun 11 2003 Cinch Connectors, Inc. Electrical connector
7263770, Jun 11 2003 Cinch Connectors, Inc. Electrical connector
7287322, Dec 02 1998 FormFactor, Inc. Lithographic contact elements
7289329, Jun 04 2004 Vitesco Technologies USA, LLC Integration of planar transformer and/or planar inductor with power switches in power converter
7295448, Jun 04 2004 Vitesco Technologies USA, LLC Interleaved power converter
7358603, Aug 10 2006 BeCe Pte Ltd High density electronic packages
7402049, Aug 24 2006 Hon Hai Precision Ind. Co., Ltd. Contact for an interposer-type connector array
7426099, Jun 30 2005 Continental Automotive Systems, Inc Controller method, apparatus and article suitable for electric drive
7443692, May 16 2003 Continental Automotive Systems, Inc Power converter architecture employing at least one capacitor across a DC bus
7455556, Jun 11 2003 CINCH CONNECTORS, INC Electrical contact
7473104, Dec 12 2007 Hon Hai Precision Ind. Co., Ltd. Electrical connector having improved two-half contacts for land grid array socket
7505294, May 16 2003 Continental Automotive Systems, Inc Tri-level inverter
7555834, Oct 17 2003 Integrated System Technologies, LLC Method of manufacturing an interconnection device
7555836, Dec 02 1998 FormFactor, Inc. Method of making lithographic contact elements
7614883, Jun 11 2003 Cinch Connectors, Inc. Electrical connector
7625216, Jun 11 2003 CINCH CONNECTORS, INC Electrical connector
7628661, Mar 31 2008 Hon Hai Precision Ind. Co., LTD Electrical contact
7787257, Feb 05 2008 Fujitsu Limited Printed wiring board unit
7798822, Feb 13 1998 FormFactor, Inc. Microelectronic contact structures
7878817, May 12 2008 Hon Hai Precision Ind. Co., Ltd. Electrical contact with X-Y offsets
7900347, Jun 26 2002 R&D Sockets, Inc Method of making a compliant interconnect assembly
8519274, Mar 08 2011 LENOVO INTERNATIONAL LIMITED Pin that inserts into a circuit board hole
8888502, Nov 15 2012 Hon Hai Precision Industry Co., Ltd. Electrical connector with dual contact halves
D574776, Aug 09 2007 Solarwatt AG Omega-connector
D574777, Aug 09 2007 Solarwatt AG C-connector
D577676, Nov 26 2007 Solarwatt AG Z-connector
D579414, Aug 09 2007 Solarwatt AG E-connector
Patent Priority Assignee Title
4354729, Dec 22 1980 AMP Incorporated Preloaded electrical contact terminal
4511197, Aug 01 1983 AMP Incorporated High density contact assembly
4513353, Dec 27 1982 AMP Incorporated Connection of leadless integrated circuit package to a circuit board
4647124, Oct 16 1985 AMP Incorporated Electrical connector for interconnecting arrays of conductive areas
4655519, Oct 16 1985 AMP Incorporated Electrical connector for interconnecting arrays of conductive areas
4699593, Jan 14 1986 AMP Incorporated Connector having contact modules for a substrate such as an IC chip carrier
4906194, Apr 13 1989 AMP Incorporated High density connector for an IC chip carrier
4921430, Jun 26 1987 YAMAICHI ELECTRONICS CO , LTD Connector for the use of electronic parts
4927369, Feb 22 1989 AMP Incorporated Electrical connector for high density usage
4969826, Dec 16 1989 AMP Incorporated High density connector for an IC chip carrier
5092783, May 16 1991 Motorola, Inc. RF interconnect
5167512, Jul 05 1991 Multi-chip module connector element and system
5230632, Dec 19 1991 International Business Machines Corporation Dual element electrical contact and connector assembly utilizing same
5324205, Mar 22 1993 GLOBALFOUNDRIES Inc Array of pinless connectors and a carrier therefor
5342205, Feb 20 1991 Japan Aviation Electronics Industry, Limited Electric connector in which a plurality of contact members can be readily assembled to an insulator
5437556, Apr 09 1993 Framatome Connectors Intl Intermediate connector for use between a printed circuit card and a substrate for electronic circuits
5484295, Apr 01 1994 Teledyne Technologies Incorporated Low profile compression electrical connector
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Aug 28 1995GRABBE, DIMITRY G WHITAKER CORPORATION, THEASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0076150202 pdf
Aug 31 1995The Whitaker Corporation(assignment on the face of the patent)
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