The present invention relates to a radiator sheet improvement and more particularly to a structure with enhanced strength and increased heat exchange surface after assembling, which is achieved first by forming large holes and adjacent small holes on each radiator sheet, wherein a radiator tube passing through each large hole and a solder rod or tin solder inserted into each small hole, and then by using heat to melt solder to fill the space between the radiator sheet and the radiator tube, thereby enabling a firm bonding effect therebetween.
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1. A radiator sheet assembly comprising:
a) a plurality of radiator sheets, each sheet of the plurality of radiator sheets having:
i) a plurality of first holes located on a top portion thereof;
ii) a plurality of second holes, each of the plurality of second holes having a diameter smaller than a diameter of the plurality of first holes; one of the plurality of second holes being located below and spaced apart a predetermined distance from each of the plurality of first holes; and
iii) a plurality of semi-circular grooves located on an edge of a bottom portion thereof;
b) a plurality of radiator tubes connected to the plurality of radiator sheets, a first end of one of the plurality of radiator tubes being inserted into each of the plurality of first holes, and a second end of one of the plurality of radiator tubes being inserted into each of the plurality of semi-circular grooves; and
c) a plurality of solder rods, one of the plurality of solder rods being inserted into each of the plurality of second holes below the first end of one of the plurality of radiator tubes.
2. The radiator sheet assembly according to
3. The radiator sheet assembly according to
4. The radiator sheet assembly according to
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(a) Field of the Invention
The present invention relates to an improvement of a radiator sheet structure and more particularly for applying heat to melt solders flowing into a gap between the radiator sheet and the radiator tube, thereby increasing heat exchange surface area, which enhances heat exchange efficiency, and enabling radiator tubes firmly connecting to radiator sheets.
(b) Description of the Prior Art
Heat emitting can always be the core issue in today's 3C products. A conventional heat exchange device is to use, besides a fan, copper or aluminum corrugated radiator sheets and an increase of heat exchange surface can be achieved through increasing of stacked radiator sheets.
With inadequacy in heat exchange capability when using only corrugated radiator sheets, an improvement was made by adding radiator tubes on each radiator sheet. As such, the area of the connection surface therebetween, which allows heat conducting from radiator sheets to radiator tubes, is vital to heat exchange efficiency.
Referring to
As the solder wire 30 melting, liquid solder will be flowing down to fill only part of the space between the outer perimeter of the radiator tube 20 and the inner perimeter of the large hole A1, thereby causing a less stable bonding effect. Furthermore, creaks on the solder-filled space may occur when imposing an external force, which further reduces heat conductivity therebetween.
The present invention relates to a radiator sheet improvement and more particularly to a structure with enhanced strength and increased heat exchange surface after assembling, which is achieved first by forming large holes and small holes adjoining thereof on each radiator sheet, wherein a radiator tube passing through each large hole and a solder rod or tin solder inserted into each small hole, and then by using heat to melt solder to fill the space between the radiator sheet and the radiator tube, thereby enabling a firm bond therebetween.
To enable a further understanding of the said objectives and the technological methods of the invention herein, the brief description of the drawings below is followed by the detailed description of the preferred embodiments.
Referring to
By applying heat to melt solder rods 30, liquid solder 31 will then flow to enclose the outer perimeter of the radiator tube 20 and also to stick to surfaces of the radiator sheet 10 on the rim of the large hole 11 as well as between the large hole 11 and the small hole 12, thereby increasing contacting surfaces between the radiator sheet 10 and the radiator tube 20 and enhancing heat conducting efficiency therebetween.
Furthermore, with the design of grooves 13 and with one end of the radiator tube 20 already fixed in the large hole 11, the other end thereof can then be inserted in each groove 13, thereby enabling the radiator tube 20 fixing in the radiator sheet 10.
It is of course to be understood that the embodiment described herein is merely illustrative of the principles of the invention and that a wide variety of modifications thereto may be effected by persons skilled in the art without departing from the spirit and scope of the invention as set forth in the following claims.
Patent | Priority | Assignee | Title |
11774187, | Apr 19 2018 | KYUNGDONG NAVIEN CO., LTD. | Heat transfer fin of fin-tube type heat exchanger |
7409983, | Apr 01 2005 | FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO ,LTD | Heat dissipating apparatus |
7426956, | May 29 2005 | FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO ,LTD | Heat dissipating apparatus |
8245763, | Jul 13 2009 | Furui Precise Component (Kunshan) Co., Ltd.; Foxconn Technology Co., Ltd. | Heat dissipation device with guilding lines and soldered heat pipes and manufacturing method thereof |
D541758, | Dec 19 2005 | Zalman Tech Co., Ltd. | Radiator for electronic parts |
Patent | Priority | Assignee | Title |
4928756, | Aug 04 1988 | SPECTRA-PHYSICS LASERS, INC A DE CORPORATION | Heat dissipating fin and method for making fin assembly |
5509465, | Mar 10 1995 | LAI, YAW-HUEY | Heat-dissipating device for a central processing unit chip |
6006827, | Dec 28 1998 | Hon Hai Precision Ind. Co., Ltd. | Cooling device for computer component |
6382307, | Apr 16 2001 | Chaun-Choung Technology Corp. | Device for forming heat dissipating fin set |
6435266, | May 01 2001 | ANTARES CAPITAL LP, AS SUCCESSOR AGENT | Heat-pipe type radiator and method for producing the same |
6550529, | Apr 17 2002 | Sunonwealth Electric Machine Industry Co., Ltd. | Heatsink device |
6640888, | Oct 16 2002 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat sink |
6955214, | Dec 15 2003 | Radiator with seamless heat conductor | |
20030094273, | |||
20050066487, | |||
20050073811, |
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