Patent
   D541758
Priority
Dec 19 2005
Filed
Dec 19 2005
Issued
May 01 2007
Expiry
May 01 2021
Assg.orig
Entity
unknown
3
11
n/a
The ornamental design for a radiator for electronic parts, as shown and described.

FIG. 1 is a perspective view of a a radiator for electronic parts in accordance with the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Lee, Sang Gyu, Seo, Min Whan

Patent Priority Assignee Title
11774187, Apr 19 2018 KYUNGDONG NAVIEN CO., LTD. Heat transfer fin of fin-tube type heat exchanger
D567771, Dec 23 2006 Foxconn Technology Co., Ltd. Heat dissipation device
D579423, Nov 19 2007 Foxconn Technology Co., Ltd. Heat sink
Patent Priority Assignee Title
6598667, Jan 14 2002 Heat dispensing device for electronic parts
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D509486, Dec 29 2004 Hon Hai Precision Ind. Co., Ltd. Heat sink
D530682, Aug 04 2005 Molex Incorporated Heat sink fins
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Dec 13 2005LEE, SANG GYUZALMAN TECH CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0173500187 pdf
Dec 13 2005SEO, MIN WHANZALMAN TECH CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0173500187 pdf
Dec 19 2005Zalman Tech Co., Ltd.(assignment on the face of the patent)
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