Patent
   D567771
Priority
Dec 23 2006
Filed
Dec 23 2006
Issued
Apr 29 2008
Expiry
Apr 29 2022
Assg.orig
Entity
unknown
2
9
n/a
The ornamental design for a heat dissipation device, as shown and described.

FIG. 1 is a perspective view of a heat dissipation device of our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 shows the heat dissipation device of FIG. 1 having fans mounted thereon, wherein the fans are shown for illustrative purpose only and form no part of the claimed design.

Chen, Chun-Chi, Wu, Wei-Le

Patent Priority Assignee Title
11774187, Apr 19 2018 KYUNGDONG NAVIEN CO., LTD. Heat transfer fin of fin-tube type heat exchanger
D805042, Oct 27 2015 Combined heat exchanger base and embedded heat pipes
Patent Priority Assignee Title
6967845, Nov 05 2003 CPUMate Inc. Integrated heat dissipating device with curved fins
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D541758, Dec 19 2005 Zalman Tech Co., Ltd. Radiator for electronic parts
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Dec 19 2006WU, WEI-LEFOXCONN TECHNOLOGY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0186730845 pdf
Dec 19 2006CHEN, CHUN-CHIFOXCONN TECHNOLOGY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0186730845 pdf
Dec 23 2006Foxconn Technology Co., Ltd.(assignment on the face of the patent)
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