Patent
   D453744
Priority
May 11 2001
Filed
May 11 2001
Issued
Feb 19 2002
Expiry
Feb 19 2016
Assg.orig
Entity
unknown
8
3
n/a
The ornamental design for a heat sink, as shown.

FIG. 1 is a perspective view of a heat sink of our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Lee, Cheng-Chi, Fu, Xue Jin, Liu, Xiang Bo

Patent Priority Assignee Title
D492265, Apr 24 2003 Datech Technology Co., Ltd. Thermal efficient heat sink for electronic devices
D496338, Mar 10 2003 Asia Vital Components Co., Ltd. Double-winged radiator for central processing unit
D530682, Aug 04 2005 Molex Incorporated Heat sink fins
D533145, Aug 04 2005 Molex Incorporated Heat sink
D551633, Aug 04 2005 Molex Incorporated Heat sink fins
D567771, Dec 23 2006 Foxconn Technology Co., Ltd. Heat dissipation device
D747278, Sep 19 2014 GE GLOBAL SOURCING LLC Heat sink
D786807, Sep 19 2014 GE GLOBAL SOURCING LLC Heat sink
Patent Priority Assignee Title
5358032, Feb 05 1992 Renesas Electronics Corporation LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted
6241006, Mar 09 2000 Heat sink for CPU
D400188, May 22 1997 Hon Hai Precision Ind. Co., Ltd. Heat sink
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 24 2001LEE, CHENG-CHIFOXCONN COMPONENTS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0118050140 pdf
Apr 24 2001FU, XUE JINFOXCONN COMPONENTS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0118050140 pdf
Apr 24 2001LIU, XIANG POFOXCONN COMPONENTS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0118050140 pdf
May 11 2001Foxconn Precision Components Co., Ltd.(assignment on the face of the patent)
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