Patent
   D492265
Priority
Apr 24 2003
Filed
May 07 2003
Issued
Jun 29 2004
Expiry
Jun 29 2018
Assg.orig
Entity
unknown
9
6
n/a
The ornamental design for a thermal efficient heat sink for electronic devices, as shown and described.

FIG. 1 is a perspective view of a thermal efficient heat sink for electronic devices, in accordance with the present invention;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Chu, Chin-Yueh

Patent Priority Assignee Title
D602859, Oct 30 2008 ACP THULE INVESTMENTS, LLC; ICE BEAR SPV #1 Thermal energy storage module
D629878, Jan 23 2009 ACP THULE INVESTMENTS, LLC; ICE BEAR SPV #1 Air conditioner with integrated thermal energy storage
D634278, Oct 15 2009 SAPA AB Heat sink
D698740, May 23 2012 Alpoint Technologies, LLC Heat sink
D701180, Oct 10 2012 Zalman Tech Co., Ltd. Radiator for an electronic device
D717745, Dec 01 2011 Alpoint Technologies, LLC Heat sink
D747278, Sep 19 2014 GE GLOBAL SOURCING LLC Heat sink
D786807, Sep 19 2014 GE GLOBAL SOURCING LLC Heat sink
D793351, Mar 01 2016 Bitspower International Co., Ltd.; BITSPOWER INTERNATIONAL CO , LTD Heat dissipation board
Patent Priority Assignee Title
6401810, Aug 16 2001 Chaun-Choung Technology Corp. Retaining structure of heat-radiating fins
6598667, Jan 14 2002 Heat dispensing device for electronic parts
6637502, Apr 16 2002 Thermal Corp. Heat sink with converging device
6639802, Nov 05 2002 Hon Hai Precision Ind. Co., Ltd. Heat sink with interlocked fins
6651734, Dec 15 2002 Multi-element heat dissipating module
D453744, May 11 2001 Foxconn Precision Components Co., Ltd. Heat sink
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Apr 11 2003CHU, CHIN-YUEHDATECH TECHNOLOGY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0140530542 pdf
May 07 2003Datech Technology Co., Ltd.(assignment on the face of the patent)
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