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Patent
D701180
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Priority
Oct 10 2012
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Filed
Apr 10 2013
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Issued
Mar 18 2014
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Expiry
Mar 18 2028
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Assg.orig
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Entity
unknown
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3
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21
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n/a
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The ornamental design for a radiator for an electronic device, as shown and described herein.
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FIG. 1 is a top, front, and right side perspective view of a radiator for an electronic device, according to the present invention;
FIG. 2 is a front view of the a radiator for an electronic device of FIG. 1;
FIG. 3 is a rear view of the a radiator for an electronic device of FIG. 1;
FIG. 4 is a left side view of the a radiator for an electronic device of FIG. 1;
FIG. 5 is a right side view of the a radiator for an electronic device of
FIG. 1; and,
FIG. 6 is a top view of the a radiator for an electronic device of FIG. 1.
The bottom of the a radiator for an electronic device is flat and unornamented.
The portions of the disclosure that are shown in broken lines form no part of the claimed design.
Kim, Do Hyun, Park, Sang Il
Patent |
Priority |
Assignee |
Title |
5784257, |
Feb 21 1997 |
Tyco Electronics Logistics AG |
Heatsink assembly with adjustable retaining clip |
6829146, |
Dec 26 2001 |
Hewlett Packard Enterprise Development LP |
Blindmate heat sink assembly |
6924979, |
Jul 30 2001 |
Hewlett Packard Enterprise Development LP |
Mounting apparatus for coupling control circuitry to an air moving device |
6964295, |
Nov 16 2004 |
Gold Charm Limited |
Heat dissipation device |
7000687, |
Apr 22 2004 |
Hon Hai Precision Industry Co., Ltd. |
Heat dissipating device |
7249626, |
Jun 10 2005 |
CHAMP TECH OPTICAL FOSHAN CORPORATION |
Heat dissipation device |
7363966, |
Dec 30 2004 |
FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD |
Heat dissipating device |
20050103479, |
|
|
|
20050150637, |
|
|
|
20070023175, |
|
|
|
20070103871, |
|
|
|
20080173426, |
|
|
|
20080295993, |
|
|
|
20090314465, |
|
|
|
20100096103, |
|
|
|
20100172106, |
|
|
|
20130058107, |
|
|
|
D492265, |
Apr 24 2003 |
Datech Technology Co., Ltd. |
Thermal efficient heat sink for electronic devices |
D510325, |
Oct 15 2003 |
AsusTek Computer Inc. |
Thermal module |
D581883, |
May 04 2007 |
Asia Vital Components Co., Ltd. |
Heat sink |
D604705, |
Sep 15 2008 |
Foxconn Technology Co., Ltd. |
Heat dissipation device |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a