Patent
   D604705
Priority
Sep 15 2008
Filed
Sep 15 2008
Issued
Nov 24 2009
Expiry
Nov 24 2023
Assg.orig
Entity
unknown
2
7
n/a
The ornamental design for a heat dissipation device, as shown and described.

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken lines shown in the figures are included for the purpose of illustrating portions of the heat dissipation device that form no part of the claimed design.

Chen, Chun-Chi, Wu, Yi-Qiang

Patent Priority Assignee Title
D701180, Oct 10 2012 Zalman Tech Co., Ltd. Radiator for an electronic device
D950507, Apr 28 2020 AIC Inc. Heat sink
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D475354, Dec 21 2001 Heat pipe of radiator of computer
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 18 2008WU, YI-QIANGFOXCONN TECHNOLOGY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0215400588 pdf
Aug 18 2008CHEN, CHUN-CHIFOXCONN TECHNOLOGY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0215400588 pdf
Sep 15 2008Foxconn Technology Co., Ltd.(assignment on the face of the patent)
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