Patent
   D475354
Priority
Dec 21 2001
Filed
Dec 21 2001
Issued
Jun 03 2003
Expiry
Jun 03 2017
Assg.orig
Entity
unknown
5
11
n/a
The ornamental design for heat pipe of radiator of computer, shown and described.

FIG. 1 is a perspective view showing the heat pipe of radiator of computer of my new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a right side elevation view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a perspective view thereof shown exploded for ease of illustration.

Wang, Tung-Yuan

Patent Priority Assignee Title
D487885, Mar 14 2003 Datech Technology Co., Ltd. Heat pipe heat sink assembly
D579423, Nov 19 2007 Foxconn Technology Co., Ltd. Heat sink
D604705, Sep 15 2008 Foxconn Technology Co., Ltd. Heat dissipation device
D726892, Jan 23 2014 Ya Suh Dar Ventilation Co., Ltd.; YA SUH DAR VENTILATION CO , LTD Water cooling fan
ER1574,
Patent Priority Assignee Title
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5583317, Jan 14 1994 Brush Wellman Inc. Multilayer laminate heat sink assembly
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