Patent
   D487885
Priority
Mar 14 2003
Filed
May 02 2003
Issued
Mar 30 2004
Expiry
Mar 30 2018
Assg.orig
Entity
unknown
9
6
n/a
The ornamental design for a heat pipe heat sink assembly, as shown and described.

FIG. 1 is a perspective view of a heat pipe heat sink assembly, in accordance with the present invention;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Fan, Wei-Feng

Patent Priority Assignee Title
7643293, Dec 18 2007 Hon Hai Precision Industry Co., Ltd. Heat dissipation device and a method for manufacturing the same
D530682, Aug 04 2005 Molex Incorporated Heat sink fins
D533145, Aug 04 2005 Molex Incorporated Heat sink
D551633, Aug 04 2005 Molex Incorporated Heat sink fins
D663276, Jun 22 2011 Foxconn Technology Co., Ltd. Cooling fin
D664102, Sep 28 2011 Foxconn Technology Co., Ltd. Cooling fin
D805042, Oct 27 2015 Combined heat exchanger base and embedded heat pipes
D819579, Jul 22 2016 Heat sink
D833988, Jul 22 2016 Heat sink
Patent Priority Assignee Title
5704419, Jun 30 1995 International Business Machines Corporation Air flow distribution in integrated circuit spot coolers
6263957, Jan 13 2000 WSOU Investments, LLC Integrated active cooling device for board mounted electric components
6394175, Jan 13 2000 WSOU Investments, LLC Top mounted cooling device using heat pipes
6414846, Feb 20 2001 Foxconn Precision Components Co., Ltd. Heat sink assembly
6434004, Oct 11 2000 International Business Machines Corporation Heat sink assembly
D475354, Dec 21 2001 Heat pipe of radiator of computer
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 18 2003FAN, WEI-FENGDATECH TECHNOLOGY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0140360968 pdf
May 02 2003Datech Technology Co., Ltd.(assignment on the face of the patent)
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