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Patent
D579423
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Priority
Nov 19 2007
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Filed
Nov 19 2007
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Issued
Oct 28 2008
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Expiry
Oct 28 2022
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Assg.orig
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Entity
unknown
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9
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10
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n/a
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The ornamental design for a heat sink, as shown.
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FIG. 1 is a perspective view of a heat sink of our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Chang, Yuh-Ching, Zhao, Di-Qiong, Cao, Ming-Kun
Patent |
Priority |
Assignee |
Title |
8002019, |
Mar 20 2008 |
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.; Foxconn Technology Co., Ltd. |
Heat dissipation device |
D715749, |
Nov 26 2013 |
Heatscape, Inc. |
High performance high power tower heat sink |
D715750, |
Nov 26 2013 |
Kilpatrick Townsend & Stockton LLP |
Power heat sink with imbedded fly cut heat pipes |
D722574, |
Nov 26 2013 |
Heatscape, Inc. |
Power heat sink with hybrid vapor chamber—heat pipe module |
D805042, |
Oct 27 2015 |
|
Combined heat exchanger base and embedded heat pipes |
D819579, |
Jul 22 2016 |
|
Heat sink |
D833988, |
Jul 22 2016 |
|
Heat sink |
D924186, |
Mar 09 2020 |
CAMBRICON TECHNOLOGIES CORPORATION LIMITED |
Board card |
D936622, |
Jan 17 2019 |
Telefonaktiebolaget LM Ericsson (publ) |
Baffle for heat sink |
Patent |
Priority |
Assignee |
Title |
7269014, |
Mar 15 2006 |
FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO ,LTD |
Heat dissipation device |
20050061479, |
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20050103476, |
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20060054307, |
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20070044942, |
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20070095508, |
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20070169918, |
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D475354, |
Dec 21 2001 |
|
Heat pipe of radiator of computer |
D533145, |
Aug 04 2005 |
Molex Incorporated |
Heat sink |
D541758, |
Dec 19 2005 |
Zalman Tech Co., Ltd. |
Radiator for electronic parts |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a