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Patent
D722574
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Priority
Nov 26 2013
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Filed
Nov 26 2013
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Issued
Feb 17 2015
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Expiry
Feb 17 2029
TERM.DISCL.
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Assg.orig
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Entity
unknown
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11
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22
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n/a
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The ornamental design for a power heat sink with hybrid vapor chamber—heat pipe module, as shown and described.
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FIG. 1 is a top perspective view of a power heat sink with hybrid vapor chamber—heat pipe module showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is an additional perspective view thereof; and,
FIG. 8 is a disassembled view corresponding to FIG. 7.
The broken line showing on the drawing disclosure is for illustrative purposes only and forms no part of the claimed design.
Mira, Ali, Mira, Yashar, Mira, Michael
Patent |
Priority |
Assignee |
Title |
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Mar 31 2017 |
ELPIS TECHNOLOGIES INC |
Heat pipe and vapor chamber heat dissipation |
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Mar 31 2017 |
ELPIS TECHNOLOGIES INC |
Heat pipe and vapor chamber heat dissipation |
10966351, |
Mar 31 2017 |
ELPIS TECHNOLOGIES INC |
Heat pipe and vapor chamber heat dissipation |
9980410, |
Mar 31 2017 |
ELPIS TECHNOLOGIES INC |
Heat pipe and vapor chamber heat dissipation |
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May 13 2011 |
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Feb 22 2016 |
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Heatsink for optical modules |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a