Patent
   D722574
Priority
Nov 26 2013
Filed
Nov 26 2013
Issued
Feb 17 2015
Expiry
Feb 17 2029

TERM.DISCL.
Assg.orig
Entity
unknown
11
22
n/a
The ornamental design for a power heat sink with hybrid vapor chamber—heat pipe module, as shown and described.

FIG. 1 is a top perspective view of a power heat sink with hybrid vapor chamber—heat pipe module showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is an additional perspective view thereof; and,

FIG. 8 is a disassembled view corresponding to FIG. 7.

The broken line showing on the drawing disclosure is for illustrative purposes only and forms no part of the claimed design.

Mira, Ali, Mira, Yashar, Mira, Michael

Patent Priority Assignee Title
10045464, Mar 31 2017 ELPIS TECHNOLOGIES INC Heat pipe and vapor chamber heat dissipation
10575440, Mar 31 2017 ELPIS TECHNOLOGIES INC Heat pipe and vapor chamber heat dissipation
10966351, Mar 31 2017 ELPIS TECHNOLOGIES INC Heat pipe and vapor chamber heat dissipation
9980410, Mar 31 2017 ELPIS TECHNOLOGIES INC Heat pipe and vapor chamber heat dissipation
D802543, May 13 2011 Enermax Technology Corporation Cooling fin
D805043, Feb 22 2016 Heatscape.com, Inc. Heatsink for optical modules
D814625, Apr 25 2016 NeoGraf Solutions, LLC Heat spreader
D814626, Apr 25 2016 NeoGraf Solutions, LLC Heat spreader
D814627, Apr 25 2016 NeoGraf Solutions, LLC Heat spreader
D822625, Apr 26 2016 Resonac Corporation Fin for heat exchanger
D827588, Dec 27 2016 Sony Corporation Chip connector
Patent Priority Assignee Title
7249626, Jun 10 2005 CHAMP TECH OPTICAL FOSHAN CORPORATION Heat dissipation device
8322403, Sep 04 2009 CPUMate Inc.; Golden Sun News Techniques Co., Ltd. Fixing assembly for heat-absorbing surfaces of juxtaposed heat pipes and heat sink having the same
8584736, Nov 23 2009 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.; Foxconn Technology Co., Ltd. Heat sink assembly having a fin also functioning as a supporting bracket
20060175045,
20060266500,
20070107883,
20070131390,
20080105408,
20080115915,
20090049691,
20090050305,
20090173474,
20090219690,
20100181047,
20100258287,
20110024087,
20110127012,
20120103572,
20140138074,
D533145, Aug 04 2005 Molex Incorporated Heat sink
D579423, Nov 19 2007 Foxconn Technology Co., Ltd. Heat sink
D582359, Jan 07 2008 COOLER MASTER DEVELOPMENT CORPORATION Heat dissipator
////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 26 2013MIRA, ALIHEATSCAPE, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0316830139 pdf
Sep 26 2013MIRA, MICHAELHEATSCAPE, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0316830139 pdf
Sep 26 2013MIRA, YASHARHEATSCAPE, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0316830139 pdf
Nov 26 2013Heatscape, Inc.(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule