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Patent
D950507
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Priority
Apr 28 2020
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Filed
Apr 28 2020
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Issued
May 03 2022
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Expiry
May 03 2037
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Assg.orig
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Entity
unknown
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0
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18
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n/a
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The ornamental design for a heat sink, as shown and described.
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FIG. 1 is a perspective view of a heat sink showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is second perspective view thereof;
FIG. 9 is third perspective view thereof; and,
FIG. 10 is a perspective view showing the heat sink in use.
The broken lines in the drawings illustrate portions of the heat sink that form no part of the claimed design.
Lin, Yu-Hsiang, Chen, Yen-Chih, You, Hsih-Ting, Hsiao, Chi-Yuan
Patent |
Priority |
Assignee |
Title |
Patent |
Priority |
Assignee |
Title |
10281220, |
Aug 19 2016 |
ZT Group Int'l, Inc.; ZT GROUP INT L, INC |
Heat sink with vapor chamber |
11096312, |
Jun 04 2020 |
AIC Inc. |
Heat dissipation apparatus with fan |
6921328, |
May 26 1998 |
Kabushiki Kaisha Yaskawa Denki |
Cooling device for electric equipment |
7359192, |
Apr 01 2005 |
Foxconn Technology Co., Ltd. |
Cooling device for heat-generating electronic component |
7729119, |
Nov 28 2007 |
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.; Foxconn Technology Co., Ltd. |
Heat dissipation device |
8081458, |
Dec 10 2009 |
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.; Foxconn Technology Co., Ltd.; ENHANCED SPECTROMETRY, INC |
Heat dissipation apparatus for electronic device |
8300405, |
May 28 2010 |
Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.; Hon Hai Precision Industry Co., Ltd. |
Airflow duct |
8305752, |
Jul 27 2010 |
Hon Hai Precision Industry Co., Ltd. |
Air duct and electronic device incorporating the same |
8335082, |
Sep 21 2010 |
Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.; Hon Hai Precision Industry Co., Ltd. |
Heat dissipating apparatus |
20070091566, |
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20070151706, |
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20070254584, |
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20080101018, |
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20170083058, |
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D510324, |
Oct 15 2003 |
AsusTek Computer Inc. |
Thermal module |
D510325, |
Oct 15 2003 |
AsusTek Computer Inc. |
Thermal module |
D604705, |
Sep 15 2008 |
Foxconn Technology Co., Ltd. |
Heat dissipation device |
D634278, |
Oct 15 2009 |
SAPA AB |
Heat sink |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Apr 27 2020 | CHEN, YEN-CHIH | AIC INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 052513 | /0232 |
pdf |
Apr 27 2020 | HSIAO, CHI-YUAN | AIC INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 052513 | /0232 |
pdf |
Apr 27 2020 | YOU, HSIH-TING | AIC INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 052513 | /0232 |
pdf |
Apr 27 2020 | LIN, YU-HSIANG | AIC INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 052513 | /0232 |
pdf |
Apr 28 2020 | | AIC Inc. | (assignment on the face of the patent) | | / |
Date |
Maintenance Fee Events |
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Date |
Maintenance Schedule |
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