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The ornamental design for a thermal module, as shown and described.
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FIG. 1 is a perspective view of a thermal module showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a rear elevational view thereof.
Cheng, Chih-Yuan, Lin, Chi-Chang, Wang, Heng-Tsung
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Oct 29 2003 | LIN, CHI-CHANG | Asustek Computer Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014877 | /0574 | |
Oct 29 2003 | CHENG, CHIH-YUAN | Asustek Computer Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014877 | /0574 | |
Oct 29 2003 | WANG, HENG-TSUNG | Asustek Computer Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014877 | /0574 | |
Dec 31 2003 | AsusTek Computer Inc. | (assignment on the face of the patent) | / |
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