Patent
   D510324
Priority
Oct 15 2003
Filed
Dec 31 2003
Issued
Oct 04 2005
Expiry
Oct 04 2019
Assg.orig
Entity
unknown
4
7
n/a
The ornamental design for a thermal module, as shown and described.

FIG. 1 is a perspective view of a thermal module showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a rear elevational view thereof.

Cheng, Chih-Yuan, Lin, Chi-Chang, Wang, Heng-Tsung

Patent Priority Assignee Title
D950507, Apr 28 2020 AIC Inc. Heat sink
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Patent Priority Assignee Title
6137681, Aug 07 1998 Foxconn Precision Components Co., Ltd. Thermal module
6412546, Mar 15 2000 Foxconn Precision Components Co., Ltd. Heat dissipation device for integrated circuits
6480387, Mar 14 2002 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly
6560113, Jan 30 2002 Hon Hai Precision Ind. Co., Ltd. Electronic device assembly having thermal module for heat dissipation
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 29 2003LIN, CHI-CHANGAsustek Computer IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0148770574 pdf
Oct 29 2003CHENG, CHIH-YUANAsustek Computer IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0148770574 pdf
Oct 29 2003WANG, HENG-TSUNGAsustek Computer IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0148770574 pdf
Dec 31 2003AsusTek Computer Inc.(assignment on the face of the patent)
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