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Patent
D634278
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Priority
Oct 15 2009
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Filed
Apr 15 2010
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Issued
Mar 15 2011
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Expiry
Mar 15 2025
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Assg.orig
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Entity
unknown
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2
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10
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n/a
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The ornamental design for a heat sink, as shown and described.
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FIG. 1 represents a perspective view of a heat sink showing my new design;
FIG. 2 represents a side view thereof;
FIG. 3 represents a side view of one part of the heat sink shown in FIGS. 1 and 2 for ease of illustration; and,
FIG. 4 represents a perspective view of the heat sink part shown in FIG. 3.
Kharazmi, Saeid
Patent |
Priority |
Assignee |
Title |
5937517, |
Nov 12 1997 |
Eastman Kodak Company |
Method of manufacturing bonded dual extruded, high fin density heat sinks |
6138352, |
Dec 11 1997 |
Eastman Kodak Company |
Method of manufacturing an extruded, tiered high fin density heat sink |
6234246, |
May 04 1995 |
Alusuisse Technology & Management Ltd |
Heat exchanger for cooling semi-conductor components |
6520248, |
May 18 2000 |
Aavid Thermalloy LLC |
Heat sink having bonded cooling fins |
6742581, |
Aug 21 2002 |
Fujikura Ltd. |
Heat sink and fin module |
6758262, |
Oct 25 2000 |
The Furukawa Electric Co., Ltd. |
Heat sink, method for manufacturing same, and pressing jig |
7497013, |
Apr 15 2005 |
R-Theta Thermal Solutions Inc. |
Method and apparatus for coupling fins in a high-fin density heatsink to dual heat-dissipating base plates |
20020043359, |
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|
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D492265, |
Apr 24 2003 |
Datech Technology Co., Ltd. |
Thermal efficient heat sink for electronic devices |
D510325, |
Oct 15 2003 |
AsusTek Computer Inc. |
Thermal module |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Mar 27 2010 | KHARAZMI, SAEID | SAPA AB | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 024537 | /0882 |
pdf |
Apr 15 2010 | | SAPA AB | (assignment on the face of the patent) | | / |
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Maintenance Fee Events |
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