Patent
   D634278
Priority
Oct 15 2009
Filed
Apr 15 2010
Issued
Mar 15 2011
Expiry
Mar 15 2025
Assg.orig
Entity
unknown
2
10
n/a
The ornamental design for a heat sink, as shown and described.

FIG. 1 represents a perspective view of a heat sink showing my new design;

FIG. 2 represents a side view thereof;

FIG. 3 represents a side view of one part of the heat sink shown in FIGS. 1 and 2 for ease of illustration; and,

FIG. 4 represents a perspective view of the heat sink part shown in FIG. 3.

Kharazmi, Saeid

Patent Priority Assignee Title
11397378, Apr 29 2019 Coretronic Corporation Heat dissipation device and projector
D950507, Apr 28 2020 AIC Inc. Heat sink
Patent Priority Assignee Title
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6758262, Oct 25 2000 The Furukawa Electric Co., Ltd. Heat sink, method for manufacturing same, and pressing jig
7497013, Apr 15 2005 R-Theta Thermal Solutions Inc. Method and apparatus for coupling fins in a high-fin density heatsink to dual heat-dissipating base plates
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D492265, Apr 24 2003 Datech Technology Co., Ltd. Thermal efficient heat sink for electronic devices
D510325, Oct 15 2003 AsusTek Computer Inc. Thermal module
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Mar 27 2010KHARAZMI, SAEIDSAPA ABASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0245370882 pdf
Apr 15 2010SAPA AB(assignment on the face of the patent)
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