Patent
   D793351
Priority
Mar 01 2016
Filed
Mar 01 2016
Issued
Aug 01 2017
Expiry
Aug 01 2032
Assg.orig
Entity
unknown
4
32
n/a
The ornamental design for a heat dissipation board, as shown and described.

FIG. 1 is a perspective view of the heat dissipation board showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear front elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is another perspective view thereof; and,

FIG. 9 is a partial perspective view of the heat dissipation board taken along the section line 9-9 of FIG. 6 showing my new design.

Yu, Vincent

Patent Priority Assignee Title
D908100, Nov 26 2018 PTT Global Chemical Public Company Limited Microchannel heat exchanger
D908101, Nov 26 2018 PTT Global Chemical Public Company Limited Microchannel heat exchanger
D908644, Nov 26 2018 PTT Global Chemical Public Company Limited Microchannel heat exchanger
D942430, May 27 2020 LIND GLOBAL FUND II LP Antenna array
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 01 2016Bitspower International Co., Ltd.(assignment on the face of the patent)
Mar 01 2016YU, VINCENTBITSPOWER INTERNATIONAL CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0378560366 pdf
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