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The ornamental design for a combined heat sink and radiator for electronic equipment, as shown and described. |
FIG. 1 is a top, right and front perspective view of a combined heat sink and radiator for electronic equipment showing my new design;
FIG. 2 is a right side elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a front elevational view thereof; and,
FIG. 6 is a rear elevational view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 11 1989 | DICKEY, DAVID V | Product R&D Corporation | ASSIGNMENT OF ASSIGNORS INTEREST | 005022 | /0105 | |
Jan 13 1989 | Product R&D Corporation | (assignment on the face of the patent) | / |
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