Pinned heat-sink extrusion for circuit-board mounting

Abstract

Description

FIG. 1 is a perspective view of a pinned heat-sink extrusion for circuit-board mounting showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a side elevational view thereof, looking toward the right side thereof as it is shown in FIG. 1; and

FIG. 7 is a side elevational view thereof looking toward the left side thereof as it is shown in FIG. 1.

Claims

The ornamental design for a pinned heat-sink extrusion for circuit-board mounting, substantially as shown.