Patent
   D618184
Priority
Jun 19 2009
Filed
Sep 29 2009
Issued
Jun 22 2010
Expiry
Jun 22 2024
Assg.orig
Entity
unknown
9
9
n/a
The ornamental design for a heat dissipation device, as shown.

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Chen, Yu-Shu, Lin, Shan-Ju, Chang, Hsueh-Chen

Patent Priority Assignee Title
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D644615, Aug 31 2010 CANON U S A , INC Two part heat spreader
D644616, Dec 27 2010 CLOUD NETWORK TECHNOLOGY SINGAPORE PTE LTD Heat sink
D645829, Dec 27 2010 CLOUD NETWORK TECHNOLOGY SINGAPORE PTE LTD Heat sink
Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 30 2009CHANG, HSUEH-CHEN Foxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0232960336 pdf
Jul 30 2009CHEN, YU-SHUFoxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0232960336 pdf
Jul 30 2009LIN, SHAN-JUFoxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0232960336 pdf
Sep 29 2009Foxsemicon Integrated Technology, Inc.(assignment on the face of the patent)
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