PTO Wrapper PDF
Dossier Espace Google
Patent
   D644616
Priority
Dec 27 2010
Filed
Dec 27 2010
Issued
Sep 06 2011
Expiry
Sep 06 2025
Inventors
Yu, Meng-C…
Assg.orig
HON HAI PR…
Assg.curr
CLOUD NETW…
Entity
unknown
Referenced by
5
References
17
Maint.:
n/a
The ornamental design for a heat sink, as shown.

FIG. 1 is a perspective view of a heat sink showing the petitioner's design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.
INVENTORS:

Yu, Meng-Che

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
D793350, Jul 01 2015 DENSO International America, Inc.; DENSO INTERNATIONAL AMERICA, INC Heat sink
D868711, Dec 05 2018 Contemporary Visions, LLC Light engine for a light fixture
D910583, Jan 29 2020 VEEA INC Heat sink
D926077, Oct 10 2019 CALYXT, INC.; CALYXT, INC Plant separator
D942959, Jan 29 2020 VEEA INC Heat sink
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
5305185, Sep 30 1992 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Coplanar heatsink and electronics assembly
5932925, Sep 09 1996 Intricast, Inc.; INTRICAST, INC Adjustable-pressure mount heatsink system
6307747, Jul 08 1999 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Resilient processor/heat sink retaining assembly
6315032, Dec 15 1998 Foxconn Precision Components Co., Ltd. Heat sink and method for making the same
6901994, Jan 05 2004 Industrial Technology Research Institute Flat heat pipe provided with means to enhance heat transfer thereof
7254888, Jan 10 2003 International Business Machines Corporation Method for manufacturing graphite-base heat sinks
7311140, Feb 01 2000 TICONA POLYMERS, INC Heat sink assembly with overmolded carbon matrix
7391614, Mar 24 2005 Dell Products L.P. Method and apparatus for thermal dissipation in an information handling system
7609520, May 23 2007 Foxconn Technology Co., Ltd. Heat spreader with vapor chamber defined therein
7760509, Jun 16 2009 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.; Foxconn Technology Co., Ltd. Heat dissipation device having fastening structure
20020118511,
20030183379,
20060237167,
20070102147,
D618183, Jun 18 2009 Foxsemicon Integrated Technology, Inc. Heat dissipation device
D618184, Jun 19 2009 Foxsemicon Integrated Technology, Inc. Heat dissipation device
D618185, Jun 18 2009 Foxsemicon Integrated Technology, Inc. Heat dissipation device
ASSIGNMENT RECORDS    Assignment records on the USPTO
///
Executed onAssignorAssigneeConveyanceFrameReelDoc
Nov 22 2010YU, MENG-CHE HON HAI PRECISION INDUSTRY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0255400558 pdf
Dec 27 2010Hon Hai Precision Industry Co., Ltd.(assignment on the face of the patent)
Jan 12 2018HON HAI PRECISION INDUSTRY CO , LTD CLOUD NETWORK TECHNOLOGY SINGAPORE PTE LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0452810269 pdf
MAINTENANCE FEES AND DATES:    Maintenance records on the USPTO
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule