Patent
   D618185
Priority
Jun 18 2009
Filed
Sep 29 2009
Issued
Jun 22 2010
Expiry
Jun 22 2024
Assg.orig
Entity
unknown
10
9
n/a
The ornamental design for a heat dissipation device, as shown.

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Lin, Shan-Ju, Chang, Hsueh-Chen, Tsao, Chih-Jen

Patent Priority Assignee Title
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D644615, Aug 31 2010 CANON U S A , INC Two part heat spreader
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D645829, Dec 27 2010 CLOUD NETWORK TECHNOLOGY SINGAPORE PTE LTD Heat sink
D664544, Jul 20 2010 Cisco Technology, Inc. Router interface card
Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 30 2009CHANG, HSUEH-CHEN Foxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0232960271 pdf
Jul 30 2009TSAO, CHIH-JEN Foxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0232960271 pdf
Jul 30 2009LIN, SHAN-JUFoxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0232960271 pdf
Sep 29 2009Foxsemicon Integrated Technology, Inc.(assignment on the face of the patent)
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