Patent
   D644615
Priority
Aug 31 2010
Filed
Aug 31 2010
Issued
Sep 06 2011
Expiry
Sep 06 2025
Assg.orig
Entity
unknown
0
13
n/a
The ornamental design for a two-part heat spreader, as shown and described.

FIG. 1 is an enlarged top plan view of a two-part heat spreader in conjunction with a compound microheater chip; the compound microheater chip forms no part of the claimed design.

FIG. 2 is a side view of a first part heat spreader shown separately for ease of illustration.

FIG. 3 is front view of a first part heat spreader.

FIG. 4 is a top view of a first part heat spreader.

FIG. 5 is an isometric perspective view of the bottom of a first part heat spreader.

FIG. 6 is a side view of a second part heat spreader shown separately for ease of illustration.

FIG. 7 is front view of a second part heat spreader.

FIG. 8 is a top view of a second part heat spreader.

FIG. 9 is an isometric perspective view of the bottom of a second part heat spreader; and,

FIG. 10 is a perspective view of a two-part heat spreader.

Coursey, Johnathan S., Hasson, Kenton C.

Patent Priority Assignee Title
Patent Priority Assignee Title
5582240, Sep 19 1994 MOTOROLA SOLUTIONS, INC Pneumatically coupled heat sink assembly
5947191, May 07 1997 International Business Machines Electronics module heat sink with quick mounting pins
5969949, Mar 31 1998 Oracle America, Inc Interfitting heat sink and heat spreader slug
6053240, Aug 09 1996 LASALLE BUSINESS CREDIT, INC , AS AGENT Heat sink
6829144, Aug 05 2003 International Business Machines Corporation Flip chip package with heat spreader allowing multiple heat sink attachment
7385822, Jun 11 2007 FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD Clip assembly
7477517, Jan 29 2007 GLOBALFOUNDRIES Inc Integrated heat spreader and exchanger
7678616, Mar 25 2006 Intel Corporation Thermal management method including a metallic layer directly on an integrated heat spreader and integrated circuit
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D367469, Sep 19 1994 Motorola, Inc Heat sink
D618183, Jun 18 2009 Foxsemicon Integrated Technology, Inc. Heat dissipation device
D618184, Jun 19 2009 Foxsemicon Integrated Technology, Inc. Heat dissipation device
D618185, Jun 18 2009 Foxsemicon Integrated Technology, Inc. Heat dissipation device
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Aug 31 2010Canon U.S. Life Sciences, Inc.(assignment on the face of the patent)
Nov 11 2010COURSEY, JOHNATHAN SCANON U S LIFE SCIENCES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0253610665 pdf
Nov 11 2010HASSON, KENTON C CANON U S LIFE SCIENCES, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0253610665 pdf
Jul 31 2019CANON U S LIFE SCIENCES, INC CANON U S A , INC MERGER AND CHANGE OF NAME SEE DOCUMENT FOR DETAILS 0546400171 pdf
Jul 31 2019CANON U S A , INC CANON U S A , INC MERGER AND CHANGE OF NAME SEE DOCUMENT FOR DETAILS 0546400171 pdf
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