Cooling device

The ornamental design for a cooling device, as shown and described.

FIG. 1 is a perspective view of a cooling device showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof, the right side being a mirror image; and,

FIG. 6 is a bottom plan view thereof.

Patent	Priority	Assignee	Title
D616378,	Jun 18 2009	Foxsemicon Integrated Technology, Inc.	Heat dissipation device
D618183,	Jun 18 2009	Foxsemicon Integrated Technology, Inc.	Heat dissipation device
D618184,	Jun 19 2009	Foxsemicon Integrated Technology, Inc.	Heat dissipation device
D618185,	Jun 18 2009	Foxsemicon Integrated Technology, Inc.	Heat dissipation device
D618632,	Jul 21 2009	Foxsemicon Integrated Technology, Inc.	Heat dissipation device
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D793350,	Jul 01 2015	DENSO International America, Inc.; DENSO INTERNATIONAL AMERICA, INC	Heat sink
D880436,	Nov 15 2018	RB Distribution, Inc.	Heat sink for a control module

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Executed on	Assignor	Assignee	Conveyance	Frame	Reel	Doc
May 25 2007	DODSON, DOUGLAS A	OCZ TECHNOLOGY GROUP, INC	ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS	019407	0072	pdf
May 10 2012	OCZ TECHNOLOGY GROUP, INC	WELLS FARGO CAPITAL FINANCE, LLC, AS AGENT	SECURITY AGREEMENT	028440	0866	pdf
Mar 11 2013	WELLS FARGO CAPITAL FINANCE, LLC, AS AGENT	OCZ TECHNOLOGY GROUP, INC	RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS	030088	0443	pdf

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