Heat dissipation device

The ornamental design for a heat dissipation device, as shown.

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Patent

Priority

Assignee

Title

Patent	Priority	Assignee	Title
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6648065,	May 18 2001	Delta Electronics, Inc.	Heat-dissipating module
6874566,	Sep 19 2003	Dell Products L.P.	Heat sink with intermediate fan element
7325593,	Mar 21 2001	SUIKOH TOP LINE CO , LTD	Radiating fin and radiating method using the radiating fin
7440282,	May 16 2006	DELPHI TECHNOLOGIES IP LIMITED	Heat sink electronic package having compliant pedestal
D286396,	Feb 29 1984	ABB INSTRUMENTATION INC	Power supply heat sink
D376132,	Dec 27 1995		Heatsink-outfitted speed controller housing
D378815,	Jun 19 1995	OCZ TECHNOLOGY GROUP, INC	Heat sink
D402025,	Oct 14 1997	OCZ TECHNOLOGY GROUP, INC	Cooling device
D529873,	May 14 2005	Foxconn Technology Co., Ltd.	Heat sink

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Executed on	Assignor	Assignee	Conveyance	Frame	Reel	Doc
Oct 19 2009	CHANG, HSUEH-CHEN	Foxsemicon Integrated Technology, Inc	ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS	023421	0509	pdf
Oct 19 2009	LIN, SHAN-JU	Foxsemicon Integrated Technology, Inc	ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS	023421	0509	pdf
Oct 26 2009		Foxsemicon Integrated Technology, Inc.	(assignment on the face of the patent)

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