Patent
   D616378
Priority
Jun 18 2009
Filed
Sep 22 2009
Issued
May 25 2010
Expiry
May 25 2024
Assg.orig
Entity
unknown
4
9
n/a
The ornamental design for a heat dissipation device, as shown.

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Lin, Shan-Ju, Chien, Ming-Chin, Chang, Hsueh-Chen

Patent Priority Assignee Title
D684544, May 13 2011 Fuji Electric Co., Ltd. Cooling jacket for semiconductor device
D715747, Sep 06 2013 Mitsubishi Electric Corporation Cooling jacket
ER5556,
ER9613,
Patent Priority Assignee Title
5574626, Jul 12 1995 Unisys Corporation Add-on heat sink
6295202, Jun 29 2000 Hewlett-Packard Company Heatsink for actively cooled daughterboard system
6343014, Aug 11 2000 Ming-Chuan, Yu CPU cooling arrangement
20030183373,
20040104021,
20070272400,
20090139690,
D285301, Apr 23 1984 LASALLE BUSINESS CREDIT, INC Pinned heat-sink extrusion for circuit-board mounting
D402025, Oct 14 1997 OCZ TECHNOLOGY GROUP, INC Cooling device
////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 30 2009CHANG, HSUEH-CHEN Foxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0232680310 pdf
Jul 30 2009CHIEN, MING-CHINFoxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0232680310 pdf
Jul 30 2009LIN, SHAN-JUFoxsemicon Integrated Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0232680310 pdf
Sep 22 2009Foxsemicon Integrated Technology, Inc.(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule