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Patent
D616378
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Priority
Jun 18 2009
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Filed
Sep 22 2009
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Issued
May 25 2010
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Expiry
May 25 2024
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Assg.orig
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Entity
unknown
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4
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9
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n/a
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The ornamental design for a heat dissipation device, as shown.
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FIG. 1 is a perspective view of a heat dissipation device showing our new design.
FIG. 2 is a front elevational view thereof.
FIG. 3 is a rear elevational view thereof.
FIG. 4 is a left-side, elevational view thereof.
FIG. 5 is a right-side, elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Lin, Shan-Ju, Chien, Ming-Chin, Chang, Hsueh-Chen
Patent |
Priority |
Assignee |
Title |
5574626, |
Jul 12 1995 |
Unisys Corporation |
Add-on heat sink |
6295202, |
Jun 29 2000 |
Hewlett-Packard Company |
Heatsink for actively cooled daughterboard system |
6343014, |
Aug 11 2000 |
Ming-Chuan, Yu |
CPU cooling arrangement |
20030183373, |
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20040104021, |
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20070272400, |
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20090139690, |
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D285301, |
Apr 23 1984 |
LASALLE BUSINESS CREDIT, INC |
Pinned heat-sink extrusion for circuit-board mounting |
D402025, |
Oct 14 1997 |
OCZ TECHNOLOGY GROUP, INC |
Cooling device |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a