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The ornamental design for a cooling jacket for semiconductor device, as shown and described.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 01 2011 | NAGAUNE, FUMIO | FUJI ELECTRIC CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 027220 | /0847 | |
Nov 14 2011 | Fuji Electric Co., Ltd. | (assignment on the face of the patent) | / |
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