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Patent
   D295401
Priority
Mar 11 1985
Filed
Mar 11 1985
Issued
Apr 26 1988
Expiry
Apr 26 2002
Inventors
Klees, Gar…
Assg.orig
XINTEX COR…
Assg.curr
UNION BANK…
DETECTS IN…
Entity
unknown
Referenced by
17
References
7
Maint.:
n/a
The ornamental design for an electronic circuit board housing, substantially as shown and described.

FIG. 1 is an isometric view of an electronic circuit board housing showing my new design;

FIG. 2 is a side elevational view thereof; the opposite side being identical;

FIG. 3 is a front elevational view thereof, the rear view being identical;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof.
INVENTORS:

Klees, Garry W.

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
D412888, Mar 27 1997 1273239 Ontario Limited Integrated circuit holder
D496339, Jan 31 2003 Glaxo Group Limited Holder, in particular for a microfluidic chip structure
D566060, Apr 13 2005 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
D577691, Apr 13 2005 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
D577692, Apr 13 2005 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
D633877, Mar 26 2010 Advanced Micro Devices, INC Socket frame
D633878, Mar 26 2010 Advanced Micro Devices, INC Socket cover cap
D633879, Mar 26 2010 Advanced Micro Devices, INC Socket cap
D633880, Mar 26 2010 Advanced Micro Devices, INC Socket housing
D641720, Mar 26 2010 Advanced Micro Devices, INC Circuit package lid
D645426, Mar 26 2010 Advanced Micro Devices, INC Socket assembly
D648688, Mar 26 2010 Advanced Micro Devices, Inc. Socket housing
D658607, Mar 26 2010 Advanced Micro Devices, Inc. Circuit package lid
D661667, Mar 26 2010 Advanced Micro Devices, Inc. Socket assembly
D684544, May 13 2011 Fuji Electric Co., Ltd. Cooling jacket for semiconductor device
D779430, Jan 21 2015 SUMITOMO SEIKA CHEMICALS CO , LTD ; National Institute of Advanced Industrial Science and Technology; I&P CO , LTD Molded coil
D810020, Jan 21 2015 SUMITOMO SEIKA CHEMICALS CO , LTD ; National Institute of Advanced Industrial Science and Technology; I&P CO , LTD Molded coil
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
31836,
4322702, Oct 19 1979 Tyco Electronic Logistics AG Electromagnetic relay
4455448, Dec 02 1981 STELLEX MICROWAVE SYSTEMS, INC , A CALIFORNIA CORPORATION Housing for microwave electronic devices
4468718, Apr 13 1982 ERICSSON GE MOBILE COMMUNICATIONS INC Enclosure and mounting member for printed circuit boards
4533976, Dec 24 1981 Canon Kabushiki Kaisha Electronic unit
218039,
D286740, Sep 26 1983 Svagstroms Montage HB Protective cover for low voltage equipment
ASSIGNMENT RECORDS    Assignment records on the USPTO
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 24 1985KLEES, GARRY W XINTEX CORPORATION, A CORP OF WAASSIGNMENT OF ASSIGNORS INTEREST 0043810490 pdf
Mar 11 1985Detects Inc.(assignment on the face of the patent)
Apr 24 1987XINTEX CORPORATION, A WA CORP UNION BANK, 942 PACIFIC AVENUE, TACOMA, WASHINGTON 98401, A WA CORP ASSIGNMENT OF ASSIGNORS INTEREST 0047880939 pdf
Apr 24 1987UNION BANK, A WA BANKING CORP DETECTS INC , 100 COMMERCE AVENUE S W , GRAND RAPIDS, MICHIGAN 49503, A MI CORP ASSIGNMENT OF ASSIGNORS INTEREST 0047880952 pdf
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