Patent
   D641720
Priority
Mar 26 2010
Filed
Mar 26 2010
Issued
Jul 19 2011
Expiry
Jul 19 2025
Assg.orig
Entity
unknown
26
31
n/a
The ornamental design for a circuit package lid, as shown and described.

FIG. 1 is a front perspective view of a circuit package lid;

FIG. 2 is a front view of the circuit package lid;

FIG. 3 is a top view of the circuit package lid;

FIG. 4 is a bottom view of the circuit package lid;

FIG. 5 is a left side view of the circuit package lid;

FIG. 6 is a right side view of the circuit package lid; and,

FIG. 7 is a rear view of the circuit package lid.

Dandia, Sanjay, Leong, Chia-Ken, Heng, Stephen, Banouvong, Nikon

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 26 2010Advanced Micro Devices, Inc.(assignment on the face of the patent)
May 14 2010HENG, STEPHENAdvanced Micro Devices, INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0245300886 pdf
May 14 2010BANOUVONG, NIKONAdvanced Micro Devices, INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0245300886 pdf
May 24 2010DANDIA, SANJAYAdvanced Micro Devices, INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0245300886 pdf
May 24 2010LEONG, CHIA-KENAdvanced Micro Devices, INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0245300886 pdf
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