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The ornamental design for a circuit board material, as shown and described.
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The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.
The upper layer of the circuit board material is a flat, transparent surface in which an underlying second layer showing a woven structure is visible through the first upper layer.
Dashed-dot-dashed broken lines define the boundary lines of the enlarged portions of the design in
Kouchi, Masahiko, Nakabayashi, Makoto
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Oct 01 2013 | NAKABAYASHI, MAKOTO | SUMITOMO ELECTRIC FINE POLYMER, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031909 | 0072 | |
Oct 01 2013 | NAKABAYASHI, MAKOTO | SUMITOMO ELECTRIC PRINTED CIRCUITS, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031909 | 0072 | |
Oct 07 2013 | KOUCHI, MASAHIKO | SUMITOMO ELECTRIC FINE POLYMER, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031909 | 0072 | |
Oct 07 2013 | KOUCHI, MASAHIKO | SUMITOMO ELECTRIC PRINTED CIRCUITS, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031909 | 0072 | |
Jan 07 2014 | Sumitomo Electric Fine Polymer, Inc. | (assignment on the face of the patent) | ||||
Jan 07 2014 | Sumitomo Electric Printed Circuits, Inc. | (assignment on the face of the patent) |
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