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The ornamental design for a semi-conductor mounting substrate, as shown. |
FIG. 1 is a top perspective view of a semi-conductor mounting substrate showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a rear elevational view thereof; and
FIG. 6 is a front elevational view thereof.
FIG. 7 is a top plan view thereof; and
FIG. 8 is a bottom plan view thereof.
Hasegawa, Terutomi, Goto, Nobumichi
Patent | Priority | Assignee | Title |
D534133, | Apr 18 2005 | Murata Manufacturing Co., Ltd. | Semiconductor module |
D540272, | Apr 18 2005 | Murata Manufacturing Co., Ltd. | Semiconductor module |
D540273, | Apr 18 2005 | Murata Manufacturing Co., Ltd. | Semiconductor module |
D687387, | Feb 06 2009 | ABB S.p.A. | Circuit breakers |
D690672, | Oct 04 2011 | Kabushiki Kaisha Yaskawa Denki | Encoder optical module |
D700440, | Oct 14 2011 | Under Armour, Inc.; Under Armour, Inc | Camouflage pattern |
D700441, | Oct 14 2011 | Under Armour, Inc.; Under Armour, Inc | Camouflage pattern |
D707636, | Feb 06 2009 | ABB S.p.A. | Circuit breakers |
D716241, | Jul 11 2013 | Sumitomo Electric Printed Circuits, Inc.; Sumitomo Electric Fine Polymer, Inc. | Wiring board |
D716741, | Jul 11 2013 | Sumitomo Electric Printed Circuits, Inc.; Sumitomo Electric Fine Polymer, Inc. | Wiring board |
D734732, | Jul 10 2013 | Sumitomo Electric Fine Polymer, Inc.; Sumitomo Electric Printed Circuits, Inc. | Circuit board material |
D752524, | Nov 09 2012 | ABB S.p.A. | Circuit breaker |
D757659, | Feb 06 2009 | ABB S.p.A. | Circuit breakers |
D789895, | Nov 09 2012 | ABB S.p.A. | Circuit breaker |
D804430, | Feb 06 2009 | ABB S.p.A. | Circuit breakers |
D808664, | May 16 2016 | Ninja Brand Incorporated | Sheet with camouflage pattern |
D813182, | Aug 02 2016 | PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD | Semiconductor device |
D823816, | Nov 09 2012 | ABB S.p.A. | Circuit breaker |
D853337, | Feb 06 2009 | ABB S.p.A. | Circuit breakers |
D858460, | Nov 09 2012 | ABB S.p.A. | Circuit breaker |
D883939, | Feb 06 2009 | ABB S.p.A. | Circuit breakers |
D883940, | Nov 09 2012 | ABB S.p.A. | Circuit breaker |
D913256, | Jul 31 2019 | Antenna pattern for a semiconductive substrate carrier | |
D926716, | Jul 31 2019 | Antenna pattern for a semiconductive substrate carrier | |
D934820, | Oct 24 2019 | NUVOTON TECHNOLOGY CORPORATION JAPAN | Semiconductor device |
D934821, | Jul 24 2019 | NUVOTON TECHNOLOGY CORPORATION JAPAN | Semiconductor device |
D937232, | Oct 24 2019 | NUVOTON TECHNOLOGY CORPORATION JAPAN | Semiconductor device |
D937233, | Oct 24 2019 | NUVOTON TECHNOLOGY CORPORATION JAPAN | Semiconductor device |
D938925, | Oct 24 2019 | NUVOTON TECHNOLOGY CORPORATION JAPAN | Semiconductor device |
D951212, | Dec 11 2019 | PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD | Semiconductor device |
D951213, | Dec 11 2019 | PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD | Semiconductor device |
D951214, | Dec 11 2019 | PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD | Semiconductor device |
D951215, | Dec 11 2019 | PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD | Semiconductor device |
D988300, | Mar 09 2021 | IoT module | |
ER3457, | |||
ER7717, |
Patent | Priority | Assignee | Title |
4288841, | Sep 20 1979 | Bell Telephone Laboratories, Incorporated | Double cavity semiconductor chip carrier |
4338621, | Feb 04 1980 | SAMSUNG ELECTRONICS CO , LTD | Hermetic integrated circuit package for high density high power applications |
4437141, | Sep 14 1981 | Texas Instruments Incorporated | High terminal count integrated circuit device package |
4458291, | Jul 22 1981 | Fujitsu Limited | Package for enclosing semiconductor elements |
4513355, | Jun 15 1983 | Motorola, Inc. | Metallization and bonding means and method for VLSI packages |
4677526, | Mar 01 1984 | Thomas & Betts International, Inc | Plastic pin grid array chip carrier |
4698663, | Sep 17 1986 | Fujitsu Limited | Heatsink package for flip-chip IC |
EP232827, | |||
JP35653, | |||
JP48945, | |||
JP150353, | |||
JP271863, | |||
JP644662, | |||
JP647072, | |||
JP647074, | |||
JP647078, | |||
JP673983, | |||
JP6739831, | |||
JP673984, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Apr 13 1988 | Ibiden Co., Ltd. | (assignment on the face of the patent) | / | |||
Nov 26 1990 | HASEGAWA, TERUTOMI | IBIDEN CO , LTD , A JAPANESE CORP | ASSIGNMENT OF ASSIGNORS INTEREST | 005556 | /0266 | |
Nov 26 1990 | GOTO, NOBUMICHI | IBIDEN CO , LTD , A JAPANESE CORP | ASSIGNMENT OF ASSIGNORS INTEREST | 005556 | /0266 |
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