Patent
   D534133
Priority
Apr 18 2005
Filed
Sep 22 2005
Issued
Dec 26 2006
Expiry
Dec 26 2020
Assg.orig
Entity
unknown
0
10
n/a
The ornamental design for a semiconductor module, as shown.

FIG. 1 is a front view of a semiconductor module showing our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a left side view thereof; and,

FIG. 6 is a right side view thereof.

The broken lines shown in the drawings are for illustrative purposes only and form no part of the claimed design.

Higashibata, Kazuaki

Patent Priority Assignee Title
Patent Priority Assignee Title
5994772, Dec 19 1996 LG Semicon Co., Ltd. Semiconductor package
6127729, Jun 29 1998 Mitsubishi Denki Kabushiki Kaisha Semiconductor chip with corner electrode terminals and detecting wiring for defect inspection
6373447, Dec 28 1998 KAWASAKI MICROELECTRONICS, INC On-chip antenna, and systems utilizing same
6781239, Dec 05 2001 National Semiconductor Corporation Integrated circuit and method of forming the integrated circuit having a die with high Q inductors and capacitors attached to a die with a circuit as a flip chip
6836002, Mar 09 2000 III Holdings 10, LLC Semiconductor device
6992395, Jul 04 2001 Sony Corporation Semiconductor device and semiconductor module having external electrodes on an outer periphery
20060043544,
20060097374,
20060131715,
D318461, Apr 13 1988 IBIDEN CO , LTD , A JAPANESE CORP Semi-conductor mounting substrate
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May 29 2003Sloan Valve CompanyLASALLE BANK, N A SECURITY AGREEMENT0146830095 pdf
Jul 25 2005HIGASHIBATA, KAZUAKIMURATA MANUFACTURING CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0170220411 pdf
Sep 22 2005Murata Manufacturing Co., Ltd.(assignment on the face of the patent)
Jun 30 2021BANK OF AMERICA, N A AS SUCCESSOR-IN-INTEREST TO LASALLE BANK Sloan Valve CompanyTERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS, TRADEMARKS AND TRADENAMES0567280307 pdf
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