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Patent
D690672
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Priority
Oct 04 2011
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Filed
Apr 04 2012
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Issued
Oct 01 2013
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Expiry
Oct 01 2027
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Assg.orig
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Entity
unknown
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57
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24
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n/a
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The ornamental design for an encoder optical module, as shown and described.
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FIG. 1 is a top, right, and front perspective view of an encoder optical module, showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a front elevational view thereof, with the rear elevational view being a mirror image thereof;
FIG. 4 is a bottom plan view thereof; and,
FIG. 5 is a right side elevational view thereof, with the left side elevational view being a mirror image thereof.
All broken lines shown in the figures represent environmental structures and form no part of the claimed design of the present invention.
Yoshida, Yasushi, Muraoka, Jiro, Matsutani, Yasuhiro, Yoshidomi, Shirou
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Patent |
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Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds |
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Tag for removable part |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a