Patent
   D690672
Priority
Oct 04 2011
Filed
Apr 04 2012
Issued
Oct 01 2013
Expiry
Oct 01 2027
Assg.orig
Entity
unknown
52
24
n/a
The ornamental design for an encoder optical module, as shown and described.

FIG. 1 is a top, right, and front perspective view of an encoder optical module, showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevational view thereof, with the rear elevational view being a mirror image thereof;

FIG. 4 is a bottom plan view thereof; and,

FIG. 5 is a right side elevational view thereof, with the left side elevational view being a mirror image thereof.

All broken lines shown in the figures represent environmental structures and form no part of the claimed design of the present invention.

Yoshida, Yasushi, Muraoka, Jiro, Matsutani, Yasuhiro, Yoshidomi, Shirou

Patent Priority Assignee Title
11333677, Jul 23 2018 CACI, Inc.—Federal Methods and apparatuses for detecting tamper using heuristic models
11662698, Jul 23 2018 CACI, Inc.—Federal Methods and apparatuses for detecting tamper using machine learning models
11747775, Jul 23 2018 CACI, Inc.—Federal Integrated tamper detection system and methods
D734755, Jun 26 2013 Samsung Electronics Co., Ltd. Solid state drive
D735202, Jun 26 2013 Samsung Electronics Co., Ltd. Solid state drive
D735203, Jun 26 2013 Samsung Electronics Co., Ltd. Solid state drive
D735204, Jun 26 2013 Samsung Electronics Co., Ltd. Solid state drive
D736212, Jul 01 2014 Samsung Electronics Co., Ltd. Memory card
D736213, Jul 01 2014 Samsung Electronics Co., Ltd. Memory card
D736216, Jul 30 2014 Samsung Electronics Co., Ltd. Memory card
D739856, Jul 30 2014 Samsung Electronics Co., Ltd. Memory card
D754083, Oct 17 2013 Vicor Corporation Electric terminal
D769832, Feb 19 2013 Sony Corporation Semiconductor device
D772232, Nov 12 2015 Samsung Electronics Co., Ltd. Memory card
D773467, Nov 12 2015 Samsung Electronics Co., Ltd. Memory card
D775092, Oct 17 2013 Vicor Corporation Electric terminal
D775093, Oct 17 2013 Vicor Corporation Electric terminal
D783621, Aug 25 2015 Samsung Electronics Co., Ltd. Memory card
D783622, Aug 25 2015 Samsung Electronics Co., Ltd. Memory card
D798249, Oct 17 2013 Vicor Corporation Electric terminal
D834548, Oct 17 2013 Vicor Corporation Electric terminal
D839220, Feb 19 2013 Sony Corporation Semiconductor device
D846513, Apr 27 2016 NGK Insulators, Ltd. Sheet heater for electrostatic chuck
D872032, Sep 14 2018 TELIT COMMUNICATIONS S P A Connection module
D872033, Sep 14 2018 TELIT COMMUNICATIONS S P A Connection module
D873822, Jul 04 2014 Sakai Display Products Corporation Image display
D877147, Jul 04 2014 Sakai Display Products Corporation Image display
D877708, Oct 17 2013 Vicor Corporation Electrical terminal
D889468, Oct 24 2017 BOGEN MAGENTICS GMBH Data processing equipment
D930601, Sep 09 2019 The Noco Company Circuit board
D937792, Sep 09 2019 The Noco Company Circuit board
D937793, Sep 09 2019 The Noco Company Circuit board
D938374, Sep 09 2019 The Noco Company Circuit board
D942406, Oct 17 2013 Vicor Corporation Electric terminal
D944219, Sep 09 2019 The Noco Company Circuit board
D947800, Jul 16 2019 CACI, Inc.—Federal Integrated module
D947801, Nov 07 2019 Phoenix Contact GmbH & Co. KG Printed circuit board
D949117, Sep 09 2019 The Noco Company Circuit board
D956707, Sep 26 2019 LAPIS SEMICONDUCTOR CO , LTD Circuit board
D958762, Sep 09 2019 The Noco Company Circuit board
D989014, Sep 09 2019 The Noco Company Circuit board
ER1044,
ER1698,
ER1824,
ER1952,
ER4226,
ER428,
ER522,
ER5681,
ER686,
ER792,
ER9526,
Patent Priority Assignee Title
5905639, Sep 29 1997 Raytheon Company Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds
5994772, Dec 19 1996 LG Semicon Co., Ltd. Semiconductor package
6836002, Mar 09 2000 III Holdings 10, LLC Semiconductor device
6927416, Dec 26 2002 Disco Corporation Wafer support plate
20060097374,
D318461, Apr 13 1988 IBIDEN CO , LTD , A JAPANESE CORP Semi-conductor mounting substrate
D328599, Apr 10 1990 Gemplus Card International Connecting terminal for chip cards
D357671, Sep 16 1993 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D466093, Apr 27 2001 Taiyo Yuden Co., Ltd.; TAIYO YUDEN CO , LTD Hybird integrated circuit board
D471167, Apr 27 2001 Taiyo Yuden Co., Ltd. Hybrid integrated circuit board
D471524, Apr 27 2001 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
D540272, Apr 18 2005 Murata Manufacturing Co., Ltd. Semiconductor module
D547371, Oct 22 2005 C3KB SOLUTIONS, INC Reminder form
D576577, Nov 30 2006 Kabushiki Kaisha Toshiba Portion of a printed circuit board
D597504, Nov 30 2006 Kabushiki Kaisha Toshiba Portion of a printed circuit board
D603812, Aug 26 2008 ClevX, LLC Foldable electronic package
D605613, May 15 2008 CommScope EMEA Limited; CommScope Technologies LLC Printed circuit board for electrical connector
D615506, Jun 23 2009 DBG Group Investments, LLC Integrated energy management system
D638809, May 14 2010 Panasonic Corporation Substrate for light source of light emitting diode
D638810, May 14 2010 Panasonic Corporation Substrate for light source of light emitting diode
D651991, Aug 17 2010 Sumitomo Electric Industries, Ltd. Semiconductor substrate
D651992, Aug 17 2010 Sumitomo Electric Industries, Ltd. Semiconductor substrate
D655256, Aug 17 2010 Sumitomo Electric Industries, Ltd. Semiconductor substrate
D678227, Mar 07 2011 Ricoh Company, LTD Tag for removable part
/////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 03 2012MURAOKA, JIROKabushiki Kaisha Yaskawa DenkiASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0281150617 pdf
Apr 04 2012Kabushiki Kaisha Yaskawa Denki(assignment on the face of the patent)
Apr 09 2012YOSHIDA, YASUSHIKabushiki Kaisha Yaskawa DenkiASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0281150617 pdf
Apr 11 2012YOSHIDOMI, SHIROUKabushiki Kaisha Yaskawa DenkiASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0281150617 pdf
Apr 13 2012MATSUTANI, YASUHIROKabushiki Kaisha Yaskawa DenkiASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0281150617 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule