Patent
   D357671
Priority
Sep 16 1993
Filed
Feb 28 1994
Issued
Apr 25 1995
Expiry
Apr 25 2009
Assg.orig
Entity
unknown
43
5
n/a
The ornamental design for a hybrid integrated circuit for electric power control, as shown.

FIG. 1 is a perspective view of the top, front and right side of a hybrid integrated circuit for electric power control showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a rear elevational view thereof; and,

FIG. 7 is a bottom plan view thereof.

Soyano, Shin, Terasawa, Noriho

Patent Priority Assignee Title
9497570, Feb 06 2014 NIMBELINK CORP Embedded wireless modem
D453746, Jul 26 2001 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
D456787, Dec 08 2000 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
D459706, Apr 27 2001 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
D465463, Jun 15 2001 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
D466093, Apr 27 2001 Taiyo Yuden Co., Ltd.; TAIYO YUDEN CO , LTD Hybird integrated circuit board
D470825, Dec 28 2001 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D471167, Apr 27 2001 Taiyo Yuden Co., Ltd. Hybrid integrated circuit board
D471524, Apr 27 2001 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
D690672, Oct 04 2011 Kabushiki Kaisha Yaskawa Denki Encoder optical module
D693318, Oct 27 2011 SUMITOMO ELECTRIC INDUSTRIES, LTD Semiconductor module for power conversion
D699675, Aug 24 2012 ROSWELL CANADA, INC Amplifier module
D705184, Jul 11 2013 Fuji Electric Co., Ltd. Semiconductor module
D719537, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
D731491, Feb 07 2014 NIMBELINK CORP Embedded cellular modem
D738834, Jul 29 2014 Driver circuit integrated LED module
D745476, Oct 19 2012 Solumatics CVBA Print board
D762185, Aug 21 2014 Infineon Technologies AG Power semiconductor module
D762597, Aug 07 2014 Infineon Technologies AG Power semiconductor module
D769834, May 08 2013 Mitsubishi Electric Corporation Semiconductor device
D775091, Aug 19 2014 Infineon Technologies AG Power semiconductor module
D775593, Aug 19 2014 Infineon Technologies AG Power semiconductor module
D776071, Aug 19 2014 Infineon Technologies AG Power semiconductor module
D810036, Nov 08 2016 Fuji Electric Co., Ltd. Semiconductor module
D810706, Dec 24 2014 FUJI ELECTRIC CO., LTD Semiconductor module
D814433, Nov 28 2014 FUJI ELECTRIC CO., LTD Semiconductor module
D827593, Nov 28 2014 FUJI ELECTRIC CO., LTD Semiconductor module
D847103, Sep 07 2017 ROHM CO , LTD Power semiconductor module
D847104, Sep 29 2017 ROHM CO , LTD Power semiconductor module
D851612, Jun 30 2017 MICRODUINO INC.; MEIKE TECHNOLOGY (BEIJING) LTD. Electrical module
D858467, Jan 05 2017 Rohm Co., Ltd. Power semiconductor module
D864132, Jan 05 2017 Rohm Co., Ltd. Power semiconductor module
D875058, Jan 05 2017 Rohm Co., Ltd. Power semiconductor module
D877102, Dec 28 2017 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
D879729, Jun 30 2017 MICRODUINO INC.; MEIKE TECHNOLOGY (BEIJING) LTD. Electrical module
D903611, Mar 29 2019 Mitsubishi Electric Corporation Semiconductor device
D903612, Mar 26 2019 Fuji Electric Co., Ltd. Semiconductor module
D906271, Apr 13 2018 ROHM CO , LTD Semiconductor module
D971863, Jan 28 2020 Rohm Co., Ltd. Semiconductor module
D972516, Jan 28 2020 Rohm Co., Ltd. Semiconductor module
D978809, Apr 13 2018 Rohm Co., Ltd. Semiconductor module
D981356, Jan 28 2020 Rohm Co., Ltd. Semiconductor module
D983759, May 31 2019 Fuji Electric Co., Ltd. Semiconductor module
Patent Priority Assignee Title
3825876,
4780795, Apr 28 1986 Burr-Brown Corporation Packages for hybrid integrated circuit high voltage isolation amplifiers and method of manufacture
4943676, Jul 12 1989 PITTSBURGH, UNIVERSITY OF Thermolysis of poly(N-vinylformamide) to poly(N-vinylamine)
5053634, Jul 25 1988 Sawafuji Electric Co., Ltd. Waterproofing device for control circuit used in outboard engines
5130881, Jan 11 1988 UNITED STATES OF AMERICA, THE, AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE IC socket having overvoltage protection
///
Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 10 1994TERASAWA, NORIHOFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0068950471 pdf
Feb 10 1994SOYANO, SHINFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0068950471 pdf
Feb 28 1994Fuji Electric Co., Ltd.(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule