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Patent
D775091
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Priority
Aug 19 2014
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Filed
Feb 18 2015
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Issued
Dec 27 2016
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Expiry
Dec 27 2030
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Assg.orig
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Entity
unknown
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35
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36
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n/a
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The ornamental design for a power semiconductor module, as shown and described.
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FIG. 1 is a bottom plan view of a power semiconductor module showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a side elevational view thereof;
FIG. 4 is another side elevational view thereof; and,
FIG. 5 is a top, side perspective view thereof.
All surfaces not shown form no part of the claimed design.
Koch, Christoph, Edenharter, Stefan, Schennetten, Sven
Patent |
Priority |
Assignee |
Title |
11710687, |
May 22 2019 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Semiconductor package with guide pin |
D790491, |
Sep 30 2015 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D798832, |
Sep 30 2015 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D799439, |
May 31 2016 |
Rohm Co., Ltd. |
Power converting semiconductor module |
D805485, |
Aug 21 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
D810706, |
Dec 24 2014 |
FUJI ELECTRIC CO., LTD |
Semiconductor module |
D814433, |
Nov 28 2014 |
FUJI ELECTRIC CO., LTD |
Semiconductor module |
D827593, |
Nov 28 2014 |
FUJI ELECTRIC CO., LTD |
Semiconductor module |
D847103, |
Sep 07 2017 |
ROHM CO , LTD |
Power semiconductor module |
D847104, |
Sep 29 2017 |
ROHM CO , LTD |
Power semiconductor module |
D851612, |
Jun 30 2017 |
MICRODUINO INC.; MEIKE TECHNOLOGY (BEIJING) LTD. |
Electrical module |
D853342, |
Feb 28 2017 |
Infineon Technologies AG |
High-performance semiconductor module |
D853978, |
Feb 28 2017 |
Infineon Technologies AG |
High-performance semiconductor module |
D858467, |
Jan 05 2017 |
Rohm Co., Ltd. |
Power semiconductor module |
D864132, |
Jan 05 2017 |
Rohm Co., Ltd. |
Power semiconductor module |
D864882, |
Sep 27 2017 |
Hamamatsu Photonics K.K. |
Part for semiconductor device |
D864883, |
Sep 27 2017 |
Hamamatsu Photonics K.K. |
Part for semiconductor device |
D865690, |
Sep 27 2017 |
Hamamatsu Photonics K.K. |
Part for semiconductor device |
D875058, |
Jan 05 2017 |
Rohm Co., Ltd. |
Power semiconductor module |
D879729, |
Jun 30 2017 |
MICRODUINO INC.; MEIKE TECHNOLOGY (BEIJING) LTD. |
Electrical module |
D903612, |
Mar 26 2019 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D921048, |
Jun 04 2018 |
Semikron Elektronik GmbH & Co. KG |
Module |
D927437, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
D929462, |
Jun 04 2018 |
SEMIKRON ELEKTRONIK GMBH & CO KG |
Module |
D934188, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
D934189, |
Aug 29 2019 |
Rohm Co., Ltd. |
Circuit board for power semiconductor module |
D934190, |
Aug 29 2019 |
Rohm Co., Ltd. |
Circuit board for power semiconductor module |
D934822, |
Aug 29 2019 |
Rohm Co., Ltd. |
Circuit board for power semiconductor module |
D942403, |
Oct 24 2019 |
WOLFSPEED, INC |
Power module having pin fins |
D969761, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
D976852, |
Apr 24 2020 |
Industrial Technology Research Institute |
Power module |
D981354, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
D981355, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
D983759, |
May 31 2019 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D985517, |
Oct 24 2019 |
WOLFSPEED, INC |
Power module having pin fins |
Patent |
Priority |
Assignee |
Title |
5347160, |
Sep 28 1992 |
Sundstrand Corporation |
Power semiconductor integrated circuit package |
5512782, |
Oct 13 1993 |
FUJI ELECTRIC CO , LTD |
Semiconductor device for DC/AC converter |
6521983, |
Aug 29 2000 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device for electric power |
6774465, |
Oct 05 2001 |
Semiconductor Components Industries, LLC |
Semiconductor power package module |
20010038143, |
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20100149774, |
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20110044012, |
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D288557, |
Sep 10 1984 |
Semiconductor Components Industries, LLC |
Semiconductor housing |
D357671, |
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Fuji Electric Co., Ltd. |
Hybrid integrated circuit for electric power control |
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Sep 16 1993 |
Fuji Electric Co., Ltd. |
Hybrid integrated circuit for electric power control |
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Fuji Electric Co., Ltd. |
Hybrid integrated circuit for electric power control |
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Jan 09 1996 |
Fuji Electric Co., Ltd. |
Hybrid integrated circuit for electric power control |
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Dec 24 1996 |
FUJI ELECTRIC CO , LTD |
Hybrid integrated circuit for electric power control |
D441726, |
Jul 14 1999 |
Kabushiki Kaisha Toyoda Jidoshokki Seisakusho |
Semiconductor element |
D476959, |
Jul 31 2002 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
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May 19 2003 |
Kabushiki Kaisha Toshiba |
Power converter |
D587662, |
Dec 20 2007 |
Fuji Electric Device Technology Co., Ltd. |
Semiconductor device |
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Mar 17 2008 |
Fuji Electric Device Technology Co., Ltd. |
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Fuji Electric Co., Ltd. |
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D653634, |
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Fuji Electric Co., Ltd. |
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Aug 12 2011 |
FUJI ELECTRIC CO., LTD |
Semiconductor device |
D689446, |
Oct 28 2010 |
Fuji Electric Co., Ltd. |
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D699693, |
Oct 03 2012 |
FUJI ELECTRIC CO , LTD |
Semiconductor device |
D704670, |
Jan 24 2013 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D704671, |
Jan 24 2013 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D705184, |
Jul 11 2013 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D710317, |
Jan 24 2013 |
Fuji Electric Co., Inc. |
Semiconductor device |
D710318, |
Jan 24 2013 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D710319, |
Jan 24 2013 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D712853, |
Dec 21 2012 |
Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD |
Semiconductor module |
D719537, |
May 08 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
D721048, |
Jun 17 2013 |
FUJI ELECTRIC CO , LTD |
Semiconductor module |
D721340, |
Dec 21 2012 |
Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD |
Semiconductor module |
D748595, |
Feb 03 2015 |
Infineon Technologies AG |
Power semiconductor module |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a