FIG. 1 is a front view of a semiconductor module, showing our new design;
FIG. 2 is a rear view of the semiconductor module of FIG. 1;
FIG. 3 is a left side view of the semiconductor module of FIG. 1;
FIG. 4 is a right side view of the semiconductor module of FIG. 1;
FIG. 5 is a top view of the semiconductor module of FIG. 1;
FIG. 6 is a bottom view of the semiconductor module of FIG. 1;
FIG. 7 is a front, top, left side perspective view of the semiconductor module of FIG. 1;
FIG. 8 is another front, top, left side perspective view of the semiconductor module of FIG. 1;
FIG. 9 is a front, bottom and right side perspective view of the semiconductor module of FIG. 1;
FIG. 10 is a rear, top, and left side perspective view of the semiconductor module of FIG. 1;
FIG. 11 is a rear, bottom, and right side perspective view of the semiconductor module of FIG. 1;
FIG. 12 is another rear, bottom, and right side perspective view of the semiconductor module of FIG. 1; and,
FIG. 13 is a cross sectional view taken along line 13-13 of FIG. 5, in which the internal structure is omitted.
The broken lines shown in the drawings represent portions of the semiconductor module that form no part of the claimed design.
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