Patent
   D903612
Priority
Mar 26 2019
Filed
Sep 10 2019
Issued
Dec 01 2020
Expiry
Dec 01 2035
Assg.orig
Entity
unknown
14
34
n/a
The ornamental design for a semiconductor module, as shown and described.

FIG. 1 is a front view of a semiconductor module showing our new design;

FIG. 2 is a rear view of the semiconductor module of FIG. 1;

FIG. 3 is a left side view of the semiconductor module of FIG. 1;

FIG. 4 is a right side view of the semiconductor module of FIG. 1;

FIG. 5 is a top view of the semiconductor module of FIG. 1;

FIG. 6 is a bottom view of the semiconductor module of FIG. 1;

FIG. 7 is a front, top and left side perspective view of the semiconductor module of FIG. 1;

FIG. 8 is a front, bottom and right side perspective view of the semiconductor module of FIG. 1;

FIG. 9 is a rear, top and left side perspective view of the semiconductor module of FIG. 1; and,

FIG. 10 is a rear, bottom and right side perspective view of the semiconductor module of FIG. 1.

Soyano, Shin, Gohara, Hiromichi

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Jul 31 2019SOYANO, SHINFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0503540479 pdf
Jul 31 2019GOHARA, HIROMICHIFUJI ELECTRIC CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0503540479 pdf
Sep 10 2019Fuji Electric Co., Ltd.(assignment on the face of the patent)
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