Patent
   D776071
Priority
Aug 19 2014
Filed
Feb 18 2015
Issued
Jan 10 2017
Expiry
Jan 10 2031
Assg.orig
Entity
unknown
33
36
n/a
The ornamental design for a power semiconductor module, as shown and described.

FIG. 1 is a bottom plan view of a power semiconductor module showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a side elevational view thereof;

FIG. 4 is another side elevational view thereof; and,

FIG. 5 is a top, side perspective view thereof.

All surfaces not shown form no part of the claimed design.

Koch, Christoph, Edenharter, Stefan, Schennetten, Sven

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 18 2015Infineon Technologies AG(assignment on the face of the patent)
Feb 20 2015KOCH, CHRISTOPHInfineon Technologies AGASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0352420298 pdf
Feb 20 2015SCHENNETTEN, SVENInfineon Technologies AGASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0352420298 pdf
Feb 24 2015EDENHARTER, STEFANInfineon Technologies AGASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0352420298 pdf
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