Patent
   D441726
Priority
Jul 14 1999
Filed
Jan 13 2000
Issued
May 08 2001
Expiry
May 08 2015
Assg.orig
Entity
unknown
55
4
n/a
The ornamental design for a semiconductor element, as shown and described.

FIG. 1 is a front elevational view showing a semiconductor element according to the present invention;

FIG. 2 is a rear elevational view of the element of FIG. 1;

FIG. 3 is a top plan view of the element of FIG. 1;

FIG. 4 is a bottom plan view of the element of FIG. 1;

FIG. 5 is a right side elevational view of the element of FIG. 1, the left side elevational view being a mirror image of the right side elevational view; and,

FIG. 6 is a top front perspective view of the element of FIG. 1.

Nagase, Toshiaki, Ishikawa, Jun, Fukatsu, Toshinari, Sofue, Kenichi, Yoshiyama, Hiromitsu

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 13 2000Kabushiki Kaisha Toyoda Jidoshokki Seisakusho(assignment on the face of the patent)
Feb 25 2000SOFUE, KENICHIKabushiki Kaisha Toyoda Jidoshokki SeisakushoASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0106880078 pdf
Feb 25 2000YOSHIYAMA, HIROMITSUKabushiki Kaisha Toyoda Jidoshokki SeisakushoASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0106880078 pdf
Feb 25 2000FUKATSU, TOSHINARIKabushiki Kaisha Toyoda Jidoshokki SeisakushoASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0106880078 pdf
Feb 25 2000NAGASE, TOSHIAKIKabushiki Kaisha Toyoda Jidoshokki SeisakushoASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0106880078 pdf
Feb 25 2000ISHIKAWA, JUNKabushiki Kaisha Toyoda Jidoshokki SeisakushoASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0106880078 pdf
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