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The ornamental design for a semiconductor element, as shown and described. |
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FIG. 1 is a front elevational view showing a semiconductor element according to the present invention;
FIG. 2 is a rear elevational view of the element of FIG. 1;
FIG. 3 is a top plan view of the element of FIG. 1;
FIG. 4 is a bottom plan view of the element of FIG. 1;
FIG. 5 is a right side elevational view of the element of FIG. 1, the left side elevational view being a mirror image of the right side elevational view; and,
FIG. 6 is a top front perspective view of the element of FIG. 1.
Nagase, Toshiaki, Ishikawa, Jun, Fukatsu, Toshinari, Sofue, Kenichi, Yoshiyama, Hiromitsu
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| Feb 25 2000 | SOFUE, KENICHI | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010688 | /0078 | |
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| Feb 25 2000 | NAGASE, TOSHIAKI | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010688 | /0078 | |
| Feb 25 2000 | ISHIKAWA, JUN | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010688 | /0078 |
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