PTO
Wrapper
PDF
|
Dossier
Espace
Google
|
|
Patent
D703625
|
Priority
Dec 06 2012
|
Filed
Mar 18 2013
|
Issued
Apr 29 2014
|
Expiry
Apr 29 2028
|
|
Assg.orig
|
|
Entity
unknown
|
28
|
20
|
n/a
|
|
|
The ornamental design for a power semiconductor module, as shown and described.
|
FIG. 1 is a perspective view of a power semiconductor module showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Lim, Jae Hyun, Kim, Tae Hyun, Kim, Jong Man, Yang, Si Joong, Lee, Young Ki, Sohn, Young Ho, Oh, Kyu Kwan
Patent |
Priority |
Assignee |
Title |
D712853, |
Dec 21 2012 |
Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD |
Semiconductor module |
D717253, |
Oct 11 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D717254, |
Oct 11 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D717255, |
Sep 20 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D717256, |
Sep 20 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D719113, |
Sep 20 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D719926, |
Sep 20 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D721048, |
Jun 17 2013 |
FUJI ELECTRIC CO , LTD |
Semiconductor module |
D721340, |
Dec 21 2012 |
Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD |
Semiconductor module |
D724554, |
Feb 19 2014 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D732537, |
Jan 18 2013 |
MERCURY MISSION SYSTEMS, LLC |
Removable device interface with attached devices |
D733144, |
May 14 2013 |
MERCURY MISSION SYSTEMS, LLC |
Removable device interface |
D748595, |
Feb 03 2015 |
Infineon Technologies AG |
Power semiconductor module |
D754084, |
Aug 21 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
D755741, |
Feb 18 2015 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Power device package |
D755742, |
Feb 18 2015 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
Power device package |
D759604, |
Jun 17 2015 |
Mitsubishi Electric Corporation |
Semiconductor device |
D761746, |
Nov 04 2014 |
Sumitomo Electric Industries, Ltd. |
Semiconductor module for power conversion |
D762597, |
Aug 07 2014 |
Infineon Technologies AG |
Power semiconductor module |
D785577, |
Aug 21 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
D790491, |
Sep 30 2015 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D798832, |
Sep 30 2015 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D799439, |
May 31 2016 |
Rohm Co., Ltd. |
Power converting semiconductor module |
D805485, |
Aug 21 2013 |
Mitsubishi Electric Corporation |
Semiconductor device |
D827591, |
Oct 31 2016 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D884662, |
Jun 01 2018 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D916039, |
Mar 20 2020 |
Sansha Electric Manufacturing Co., Ltd. |
Semiconductor device |
D949807, |
Mar 13 2020 |
Sansha Electric Manufacturing Company, Limited |
Semiconductor module |
Patent |
Priority |
Assignee |
Title |
5408128, |
Sep 15 1993 |
International Rectifier Corporation |
High power semiconductor device module with low thermal resistance and simplified manufacturing |
6078501, |
Dec 22 1997 |
Omnirel LLC |
Power semiconductor module |
7425757, |
Dec 22 2003 |
FUJI ELECTRIC CO , LTD |
Semiconductor power module |
20010038143, |
|
|
|
20100149774, |
|
|
|
20110044012, |
|
|
|
D364383, |
May 11 1994 |
Fuji Electric Co., Ltd. |
Semi-conductor element with terminal casing |
D364384, |
May 23 1994 |
Fuji Electric Co., Ltd. |
Semi-conductor element with terminal casing |
D364385, |
May 11 1994 |
Fuji Electric Co., Ltd. |
Semi-conductor element with terminal casing |
D441726, |
Jul 14 1999 |
Kabushiki Kaisha Toyoda Jidoshokki Seisakusho |
Semiconductor element |
D448739, |
Sep 12 2000 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D476959, |
Jul 31 2002 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D587662, |
Dec 20 2007 |
Fuji Electric Device Technology Co., Ltd. |
Semiconductor device |
D589012, |
Mar 17 2008 |
Fuji Electric Device Technology Co., Ltd. |
Semiconductor device |
D606951, |
Nov 14 2008 |
Fuji Electric Device Technology Co, Ltd. |
Semiconductor device |
D648290, |
Jun 08 2010 |
Miyoshi Electronics Corporation |
Semiconductor device |
D653633, |
Dec 14 2010 |
Fuji Electric Co., Ltd. |
Semiconductor |
D653634, |
Oct 28 2010 |
Fuji Electric Co., Ltd. |
Semiconductor |
D674760, |
Apr 01 2011 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D686174, |
Aug 12 2011 |
FUJI ELECTRIC CO., LTD |
Semiconductor device |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Mar 18 2013 | | Samsung Electro-Mechanics Co., Ltd. | (assignment on the face of the patent) | | / |
Mar 28 2013 | LIM, JAE HYUN | SAMSUNG ELECTRO-MECHANICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031881 | /0012 |
pdf |
Mar 28 2013 | LEE, YOUNG KI | SAMSUNG ELECTRO-MECHANICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031881 | /0012 |
pdf |
Mar 28 2013 | KIM, TAE HYUN | SAMSUNG ELECTRO-MECHANICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031881 | /0012 |
pdf |
Mar 28 2013 | YANG, SI JOONG | SAMSUNG ELECTRO-MECHANICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031881 | /0012 |
pdf |
Mar 28 2013 | KIM, JONG MAN | SAMSUNG ELECTRO-MECHANICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031881 | /0012 |
pdf |
Mar 28 2013 | OH, KYU HWAN | SAMSUNG ELECTRO-MECHANICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031881 | /0012 |
pdf |
Mar 28 2013 | SOHN, YOUNG HO | SAMSUNG ELECTRO-MECHANICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031881 | /0012 |
pdf |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a