PTO
Wrapper
PDF
|
Dossier
Espace
Google
|
|
Patent
D717256
|
Priority
Sep 20 2012
|
Filed
Mar 18 2013
|
Issued
Nov 11 2014
|
Expiry
Nov 11 2028
|
|
Assg.orig
|
|
Entity
unknown
|
40
|
35
|
n/a
|
|
|
The ornamental design for a semiconductor device, as shown and described.
|
FIG. 1 is a perspective view of a semiconductor device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Pang, Sung Man, Lee, Hyo Jin, Park, Jae Hoon, Ha, Job, Oh, Kyu Hwan, Yun, Sun Woo, Sohn, Young Ho, Kim, Jang Man, Lee, Suk Ho
Patent |
Priority |
Assignee |
Title |
D770994, |
Apr 02 2014 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D772182, |
Apr 02 2014 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D777124, |
Apr 02 2014 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D783550, |
Sep 29 2014 |
Mitsubishi Electric Corporation |
Power semiconductor device |
D852765, |
Oct 19 2017 |
Rohm Co., Ltd. |
Semiconductor device |
D853343, |
Oct 19 2017 |
Rohm Co., Ltd. |
Semiconductor device |
D859334, |
Oct 26 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
D864135, |
Oct 26 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
D873226, |
Apr 13 2018 |
ROHM CO , LTD |
Semiconductor module |
D874411, |
Apr 13 2008 |
ROHM CO , LTD |
Semiconductor module |
D874412, |
Apr 13 2018 |
ROHM CO , LTD |
Semiconductor module |
D877102, |
Dec 28 2017 |
Shindengen Electric Manufacturing Co., Ltd. |
Semiconductor module |
D888673, |
Jun 26 2018 |
Rohm Co., Ltd. |
Semiconductor module |
D902877, |
Jun 12 2018 |
Rohm Co., Ltd. |
Packaged semiconductor module |
D903613, |
Jun 26 2018 |
Rohm Co., Ltd. |
Semiconductor module |
D906271, |
Apr 13 2018 |
ROHM CO , LTD |
Semiconductor module |
D913978, |
Jun 26 2018 |
Rohm Co., Ltd. |
Semiconductor module |
D914621, |
May 14 2019 |
Rohm Co., Ltd. |
Packaged semiconductor module |
D920264, |
Nov 27 2019 |
The Noco Company |
Semiconductor device |
D932452, |
Nov 27 2019 |
The Noco Company |
Semiconductor device |
D969762, |
Apr 06 2020 |
WOLFSPEED, INC. |
Power semiconductor package |
D971863, |
Jan 28 2020 |
Rohm Co., Ltd. |
Semiconductor module |
D972516, |
Jan 28 2020 |
Rohm Co., Ltd. |
Semiconductor module |
D973029, |
Dec 15 2020 |
Rohm Co., Ltd. |
Semiconductor device |
D978809, |
Apr 13 2018 |
Rohm Co., Ltd. |
Semiconductor module |
D981356, |
Jan 28 2020 |
Rohm Co., Ltd. |
Semiconductor module |
ER1452, |
|
|
|
ER1981, |
|
|
|
ER2039, |
|
|
|
ER260, |
|
|
|
ER266, |
|
|
|
ER3437, |
|
|
|
ER3499, |
|
|
|
ER3563, |
|
|
|
ER4320, |
|
|
|
ER4634, |
|
|
|
ER4796, |
|
|
|
ER5999, |
|
|
|
ER8377, |
|
|
|
ER9811, |
|
|
|
Patent |
Priority |
Assignee |
Title |
3602846, |
|
|
|
3762039, |
|
|
|
3825876, |
|
|
|
3846734, |
|
|
|
4951124, |
Oct 24 1986 |
Kabushiki Kaisha Toshiba |
Semiconductor device |
20030042584, |
|
|
|
20100149774, |
|
|
|
D357462, |
Sep 16 1993 |
Fuji Electric Co., Ltd. |
Hybrid integrated circuit for electric power control |
D394244, |
Nov 27 1995 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D396846, |
Apr 16 1997 |
Panasonic Corporation |
Semiconductor device |
D396847, |
Oct 17 1996 |
Panasonic Corporation |
Semiconductor device |
D401912, |
Nov 27 1995 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D418485, |
Sep 29 1998 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D421969, |
Sep 29 1998 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D432097, |
Nov 20 1999 |
Samsung Electronics Co., Ltd. |
Semiconductor package |
D441727, |
Oct 04 2000 |
Sony Corporation |
Semiconductor element |
D448739, |
Sep 12 2000 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D459705, |
Mar 06 2001 |
Shindengen Electric Manufacturing Co., Ltd. |
Semiconductor package |
D466485, |
May 23 2001 |
Shindengen Electric Manufactuturing Co., Ltd. |
Semiconductor package |
D470463, |
Nov 30 2001 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D470824, |
Nov 30 2001 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D470825, |
Dec 28 2001 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D472530, |
Nov 30 2001 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D505399, |
Mar 14 2003 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D505400, |
Mar 26 2004 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device |
D539761, |
Aug 22 2006 |
Kabushiki Kaisha Toshiba |
Semiconductor |
D548202, |
Apr 17 2006 |
Kabushiki Kaisha Toshiba |
Semiconductor |
D548203, |
Apr 17 2006 |
Kabushiki Kaisha Toshiba |
Semiconductor |
D653633, |
Dec 14 2010 |
Fuji Electric Co., Ltd. |
Semiconductor |
D653634, |
Oct 28 2010 |
Fuji Electric Co., Ltd. |
Semiconductor |
D674760, |
Apr 01 2011 |
Fuji Electric Co., Ltd. |
Semiconductor device |
D686174, |
Aug 12 2011 |
FUJI ELECTRIC CO., LTD |
Semiconductor device |
D703625, |
Dec 06 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Power semiconductor module |
D705184, |
Jul 11 2013 |
Fuji Electric Co., Ltd. |
Semiconductor module |
D706232, |
Dec 21 2012 |
Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD |
Semiconductor device |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Mar 18 2013 | | Samsung Electro-Mechanics Co., Ltd. | (assignment on the face of the patent) | | / |
May 13 2013 | SOHN, YOUNG HO | SAMSUNG ELECTRO-MECHANICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 030625 | /0227 |
pdf |
May 13 2013 | HA, JOB | SAMSUNG ELECTRO-MECHANICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 030625 | /0227 |
pdf |
May 13 2013 | KIM, JONG MAN | SAMSUNG ELECTRO-MECHANICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 030625 | /0227 |
pdf |
May 13 2013 | PANG, SUNG MAN | SAMSUNG ELECTRO-MECHANICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 030625 | /0227 |
pdf |
May 13 2013 | OH, KYU HWAN | SAMSUNG ELECTRO-MECHANICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 030625 | /0227 |
pdf |
May 13 2013 | LEE, HYO JIN | SAMSUNG ELECTRO-MECHANICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 030625 | /0227 |
pdf |
May 14 2013 | LEE, SUK HO | SAMSUNG ELECTRO-MECHANICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 030625 | /0227 |
pdf |
May 14 2013 | YUN, SUN WOO | SAMSUNG ELECTRO-MECHANICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 030625 | /0227 |
pdf |
May 14 2013 | PARK, JAE HOON | SAMSUNG ELECTRO-MECHANICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 030625 | /0227 |
pdf |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a