Patent
   D717256
Priority
Sep 20 2012
Filed
Mar 18 2013
Issued
Nov 11 2014
Expiry
Nov 11 2028
Assg.orig
Entity
unknown
40
35
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a perspective view of a semiconductor device showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Pang, Sung Man, Lee, Hyo Jin, Park, Jae Hoon, Ha, Job, Oh, Kyu Hwan, Yun, Sun Woo, Sohn, Young Ho, Kim, Jang Man, Lee, Suk Ho

Patent Priority Assignee Title
D770994, Apr 02 2014 Mitsubishi Electric Corporation Power semiconductor device
D772182, Apr 02 2014 Mitsubishi Electric Corporation Power semiconductor device
D777124, Apr 02 2014 Mitsubishi Electric Corporation Power semiconductor device
D783550, Sep 29 2014 Mitsubishi Electric Corporation Power semiconductor device
D852765, Oct 19 2017 Rohm Co., Ltd. Semiconductor device
D853343, Oct 19 2017 Rohm Co., Ltd. Semiconductor device
D859334, Oct 26 2017 Mitsubishi Electric Corporation Semiconductor device
D864135, Oct 26 2017 Mitsubishi Electric Corporation Semiconductor device
D873226, Apr 13 2018 ROHM CO , LTD Semiconductor module
D874411, Apr 13 2008 ROHM CO , LTD Semiconductor module
D874412, Apr 13 2018 ROHM CO , LTD Semiconductor module
D877102, Dec 28 2017 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
D888673, Jun 26 2018 Rohm Co., Ltd. Semiconductor module
D902877, Jun 12 2018 Rohm Co., Ltd. Packaged semiconductor module
D903613, Jun 26 2018 Rohm Co., Ltd. Semiconductor module
D906271, Apr 13 2018 ROHM CO , LTD Semiconductor module
D913978, Jun 26 2018 Rohm Co., Ltd. Semiconductor module
D914621, May 14 2019 Rohm Co., Ltd. Packaged semiconductor module
D920264, Nov 27 2019 The Noco Company Semiconductor device
D932452, Nov 27 2019 The Noco Company Semiconductor device
D969762, Apr 06 2020 WOLFSPEED, INC. Power semiconductor package
D971863, Jan 28 2020 Rohm Co., Ltd. Semiconductor module
D972516, Jan 28 2020 Rohm Co., Ltd. Semiconductor module
D973029, Dec 15 2020 Rohm Co., Ltd. Semiconductor device
D978809, Apr 13 2018 Rohm Co., Ltd. Semiconductor module
D981356, Jan 28 2020 Rohm Co., Ltd. Semiconductor module
ER1452,
ER1981,
ER2039,
ER260,
ER266,
ER3437,
ER3499,
ER3563,
ER4320,
ER4634,
ER4796,
ER5999,
ER8377,
ER9811,
Patent Priority Assignee Title
3602846,
3762039,
3825876,
3846734,
4951124, Oct 24 1986 Kabushiki Kaisha Toshiba Semiconductor device
20030042584,
20100149774,
D357462, Sep 16 1993 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D394244, Nov 27 1995 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D396846, Apr 16 1997 Panasonic Corporation Semiconductor device
D396847, Oct 17 1996 Panasonic Corporation Semiconductor device
D401912, Nov 27 1995 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D418485, Sep 29 1998 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D421969, Sep 29 1998 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D432097, Nov 20 1999 Samsung Electronics Co., Ltd. Semiconductor package
D441727, Oct 04 2000 Sony Corporation Semiconductor element
D448739, Sep 12 2000 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D459705, Mar 06 2001 Shindengen Electric Manufacturing Co., Ltd. Semiconductor package
D466485, May 23 2001 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
D470463, Nov 30 2001 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D470824, Nov 30 2001 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D470825, Dec 28 2001 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D472530, Nov 30 2001 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D505399, Mar 14 2003 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D505400, Mar 26 2004 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D539761, Aug 22 2006 Kabushiki Kaisha Toshiba Semiconductor
D548202, Apr 17 2006 Kabushiki Kaisha Toshiba Semiconductor
D548203, Apr 17 2006 Kabushiki Kaisha Toshiba Semiconductor
D653633, Dec 14 2010 Fuji Electric Co., Ltd. Semiconductor
D653634, Oct 28 2010 Fuji Electric Co., Ltd. Semiconductor
D674760, Apr 01 2011 Fuji Electric Co., Ltd. Semiconductor device
D686174, Aug 12 2011 FUJI ELECTRIC CO., LTD Semiconductor device
D703625, Dec 06 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Power semiconductor module
D705184, Jul 11 2013 Fuji Electric Co., Ltd. Semiconductor module
D706232, Dec 21 2012 Fuji Electric Co., Ltd.; FUJI ELECTRIC CO , LTD Semiconductor device
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Mar 18 2013Samsung Electro-Mechanics Co., Ltd.(assignment on the face of the patent)
May 13 2013SOHN, YOUNG HOSAMSUNG ELECTRO-MECHANICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0306250227 pdf
May 13 2013HA, JOBSAMSUNG ELECTRO-MECHANICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0306250227 pdf
May 13 2013KIM, JONG MANSAMSUNG ELECTRO-MECHANICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0306250227 pdf
May 13 2013PANG, SUNG MANSAMSUNG ELECTRO-MECHANICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0306250227 pdf
May 13 2013OH, KYU HWANSAMSUNG ELECTRO-MECHANICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0306250227 pdf
May 13 2013LEE, HYO JINSAMSUNG ELECTRO-MECHANICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0306250227 pdf
May 14 2013LEE, SUK HOSAMSUNG ELECTRO-MECHANICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0306250227 pdf
May 14 2013YUN, SUN WOOSAMSUNG ELECTRO-MECHANICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0306250227 pdf
May 14 2013PARK, JAE HOONSAMSUNG ELECTRO-MECHANICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0306250227 pdf
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