Power semiconductor package

Abstract

Description

FIG. 1 is a top perspective view of a power semiconductor package showing my new design;

FIG. 2 is a bottom perspective view thereof;

FIG. 3 is a top view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a front view thereof;

FIG. 6 is a rear view thereof;

FIG. 7 is a left side view thereof; and,

FIG. 8 is a right side view thereof.

Claims

The ornamental design for a power semiconductor package, as shown and described.