Patent
   D476962
Priority
Mar 29 2002
Filed
Sep 27 2002
Issued
Jul 08 2003
Expiry
Jul 08 2017
Assg.orig
Entity
unknown
44
9
n/a
The ornamental design for a semiconductor device, as shown and described.

FIG. 1 is a front perspective view of a semiconductor device, showing our new design;

FIG. 2 is a rear perspective view thereof;

FIG. 3 is a top plan view thereof; a bottom plan view being a mirror image thereof;

FIG. 4 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;

FIG. 5 is a front elevational view thereof;

FIG. 6 is a rear elevational view thereof;

FIG. 7 is a front perspective view of a second embodiment of a semiconductor device, showing our new design;

FIG. 8 is a rear perspective view thereof;

FIG. 9 is a top plan view thereof; a bottom plan view being a mirror image thereof;

FIG. 10 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;

FIG. 11 is a front elevational view thereof; and,

FIG. 12 is a rear elevational view thereof.

Yoshihira, Takayuki, Ookura, Gentaro

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Patent Priority Assignee Title
5401910, Dec 03 1992 Murata Manufacturing Co. Ltd. Electronic component
5450286, Dec 04 1992 Parlex Corporation Printed circuit having a dielectric covercoat
5459641, Feb 18 1994 Rohm Co. Ltd. Polar electronic component and mounting structure therefor
5726859, Jul 26 1995 Dell USA, L.P. Circuit board component retainer and extractor
6232655, Jan 10 1997 Kabushiki Kaisha Toshiba Semiconductor element having external connection terminals, method of manufacturing the semiconductor element, and semiconductor device equipped with the semiconductor element
6330165, Jul 06 1998 MURATA MANUFACTURING CO , LTD Semiconductor device
6459048, Jun 25 1999 Murata Manufacturing Co., Ltd. Surface-mount electronic component
D396846, Apr 16 1997 Panasonic Corporation Semiconductor device
D444132, Aug 23 2000 Kabushiki Kaisha Toshiba Semiconductor element
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 12 2002YOSHIHIRA, TAKAYUKIKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0133360589 pdf
Aug 12 2002OOKURA, GENTAROKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0133360589 pdf
Sep 27 2002Kabushiki Kaisha Toshiba(assignment on the face of the patent)
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