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						 Patent  
						   D832227  
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						 Priority  
						Nov 15 2016 
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						 Filed 
						May 02 2017  
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						 Issued 
						Oct 30 2018 
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						 Expiry 
						Oct 30 2033 
					   
					   						
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						 Assg.orig 
						
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						 Entity 
						unknown 
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					    38 
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			  The ornamental design for a semiconductor module, as shown and described. 
			  
			  
			  
			  
			 
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FIG. 1 is a front, top, and right side perspective view of a semiconductor module showing our new design;
FIG. 2 is a rear, bottom, and left side perspective view thereof;
FIG. 3 is a front view thereof, the rear view being an identical image of FIG. 3;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a right side view thereof, the left side view being a mirror image of FIG. 6.
	
	Yoshimochi, Kenichi, Saito, Koshun, Chikamatsu, Kentaro
	
	
	  
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