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The ornamental design for a semiconductor chip package, as shown and described.
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FIG. 1 is a perspective view from the left side and above the semiconductor chip package;
FIG. 2 is a perspective view from the left side and below the semiconductor chip package;
FIG. 3 is an elevational view from the left side of the semiconductor chip package;
FIG. 4 is an elevational view from the right side of the semiconductor chip package;
FIG. 5 is an elevational view from the back side of the semiconductor chip package;
FIG. 6 is an elevational view from the front side of the semiconductor chip package;
FIG. 7 is a top view of the semiconductor chip package; and,
FIG. 8 is a bottom view of the semiconductor chip package.
Tjhia, Eddy, Kuo, Frank, Kasem, Yehja Mohammed
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