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Patent
D887998
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Priority
Feb 17 2017
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Filed
Aug 17 2017
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Issued
Jun 23 2020
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Expiry
Jun 23 2035
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Assg.orig
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Entity
unknown
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27
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18
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n/a
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The ornamental design for a chip, as shown and described.
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FIG. 1 is a perspective view of a chip showing our new design;
FIG. 2 is a top view thereof;
FIG. 3 is bottom view thereof;
FIG. 4 is a front view thereof;
FIG. 5 is a rear view thereof;
FIG. 6 is a left side view thereof; and,
FIG. 7 is a right side view thereof.
The broken lines depict environmental subject matter only and form no part of the claimed design.
Schmid, David, Krasnopolski, Krzysztof, Borek-Donten, Joanna Alicja, Bieri, Ruedi, Zijlstra, Fatma Burcu Celikkol
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Priority |
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Title |
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Sep 23 1996 |
Siemens Aktiengesellschaft |
Semiconductor chip with protection against analyzing |
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Oct 31 1995 |
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Semiconductor chip package with fan-in leads |
6297561, |
May 26 1999 |
United Microelectronics Corp. |
Semiconductor chip |
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LONGITUDE SEMICONDUCTOR S A R L |
Semiconductor device with chip size package |
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Apr 23 1987 |
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Aug 12 1993 |
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Siemens Aktiengesellschaft |
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UI TECHNOLOGIES, INC |
Chip assembly |
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Swisscom AG |
Electronic chip card |
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Apr 18 2013 |
SemiLEDS Optoelectronics Co., Ltd. |
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GEEHY MICROELECTRONICS INC |
Ink cartridge chip |
D736212, |
Jul 01 2014 |
Samsung Electronics Co., Ltd. |
Memory card |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a