|
PTO
Wrapper
PDF
|
|
Dossier
Espace
Google
|
|
|
|
Patent
D887998
|
|
Priority
Feb 17 2017
|
|
Filed
Aug 17 2017
|
|
Issued
Jun 23 2020
|
|
Expiry
Jun 23 2035
|
|
|
|
Assg.orig
|
|
|
|
Entity
unknown
|
|
30
|
|
18
|
|
n/a
|
|
|
|
The ornamental design for a chip, as shown and described.
|
FIG. 1 is a perspective view of a chip showing our new design;
FIG. 2 is a top view thereof;
FIG. 3 is bottom view thereof;
FIG. 4 is a front view thereof;
FIG. 5 is a rear view thereof;
FIG. 6 is a left side view thereof; and,
FIG. 7 is a right side view thereof.
The broken lines depict environmental subject matter only and form no part of the claimed design.
Schmid, David, Krasnopolski, Krzysztof, Borek-Donten, Joanna Alicja, Bieri, Ruedi, Zijlstra, Fatma Burcu Celikkol
| Patent |
Priority |
Assignee |
Title |
| 11333677, |
Jul 23 2018 |
CACI, Inc.—Federal |
Methods and apparatuses for detecting tamper using heuristic models |
| 11662698, |
Jul 23 2018 |
CACI, Inc.—Federal |
Methods and apparatuses for detecting tamper using machine learning models |
| 11747775, |
Jul 23 2018 |
CACI, Inc.—Federal |
Integrated tamper detection system and methods |
| D911298, |
Feb 17 2017 |
STAT PEEL AG |
Chip |
| D932051, |
Aug 30 2019 |
Kyocera Corporation |
Analysis chip for biochemical testing machine |
| D934188, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
| D934189, |
Aug 29 2019 |
Rohm Co., Ltd. |
Circuit board for power semiconductor module |
| D934190, |
Aug 29 2019 |
Rohm Co., Ltd. |
Circuit board for power semiconductor module |
| D934822, |
Aug 29 2019 |
Rohm Co., Ltd. |
Circuit board for power semiconductor module |
| D936025, |
Dec 26 2018 |
LG ENERGY SOLUTION, LTD |
Flexible printed circuit board for battery module |
| D937791, |
Dec 26 2018 |
LG ENERGY SOLUTION, LTD |
Flexible printed circuit board for battery module |
| D941786, |
Nov 22 2019 |
T-Worx Holdings, LLC |
Circuit board |
| D941788, |
Mar 06 2020 |
BYRNE ELECTRICAL SPECIALISTS, INC ; BYRNE, NORMAN R |
Circuit board |
| D947800, |
Jul 16 2019 |
CACI, Inc.—Federal |
Integrated module |
| D952181, |
Aug 30 2019 |
Kyocera Corporation |
Analysis chip for biochemical testing machine |
| D962182, |
Mar 27 2019 |
GUDENG PRECISION INDUSTRIAL CO., LTD. |
Reticle pod connecting frame |
| D968344, |
Nov 22 2019 |
T-Worx Holdings, LLC |
Circuit board |
| D969761, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
| D972746, |
Aug 21 2020 |
Kyocera Corporation |
Analysis chip for biochemical inspection machine |
| D975314, |
Aug 21 2020 |
Kyocera Corporation |
Analysis chip for biochemical inspection machine |
| D981354, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
| D981355, |
Aug 29 2019 |
Rohm Co., Ltd. |
Power semiconductor module |
| D988537, |
Aug 21 2020 |
Kyocera Corporation |
Analysis chip for biochemical inspection machine |
| ER1299, |
|
|
|
| ER1993, |
|
|
|
| ER2938, |
|
|
|
| ER3567, |
|
|
|
| ER3700, |
|
|
|
| ER7665, |
|
|
|
| ER9311, |
|
|
|
| Patent |
Priority |
Assignee |
Title |
| 6201296, |
Sep 23 1996 |
Siemens Aktiengesellschaft |
Semiconductor chip with protection against analyzing |
| 6211572, |
Oct 31 1995 |
TESSERA, INC , A CORPORATION OF DELAWARE |
Semiconductor chip package with fan-in leads |
| 6297561, |
May 26 1999 |
United Microelectronics Corp. |
Semiconductor chip |
| 6307269, |
Jul 11 1997 |
LONGITUDE SEMICONDUCTOR S A R L |
Semiconductor device with chip size package |
| 7525200, |
Dec 24 2003 |
Seiko Epson Corporation |
Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device |
| 20090230537, |
|
|
|
| D310514, |
Apr 23 1987 |
Digital Equipment Corporation |
Chip cartridge |
| D365092, |
Aug 12 1993 |
Siemens Aktiengesellschaft |
Chipcard module |
| D406822, |
Mar 06 1997 |
Siemens Aktiengesellschaft |
Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module |
| D430024, |
Jun 07 1995 |
AFFYMETRIX |
Chip packaging device |
| D456367, |
Dec 15 2000 |
Protek Devices, LP |
Semiconductor chip |
| D466873, |
Oct 31 2001 |
Siliconix Incorporated |
Semiconductor chip package |
| D472528, |
Oct 31 2001 |
Siliconix Incorporated |
Semiconductor chip package |
| D675582, |
Jun 27 2011 |
UI TECHNOLOGIES, INC |
Chip assembly |
| D711842, |
Aug 04 2011 |
Swisscom AG |
Electronic chip card |
| D715234, |
Apr 18 2013 |
SemiLEDS Optoelectronics Co., Ltd. |
Flip chip |
| D727861, |
Aug 24 2013 |
GEEHY MICROELECTRONICS INC |
Ink cartridge chip |
| D736212, |
Jul 01 2014 |
Samsung Electronics Co., Ltd. |
Memory card |
| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a