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The ornamental design for the chipcard module, as shown and described. |
FIG. 1 is a top-plan view of a chipcard module showing our new design;
FIG. 2 is a bottom-plan view thereof;
FIG. 3 is a right-side elevational view thereof;
FIG. 4 is a left-side elevational view thereof;
FIG. 5 is a front elevational view thereof;
FIG. 6 is a rear elevational view thereof;
FIG. 7 is a cross-sectional view thereof taken along the line VII--VII of FIGS. 1 and 2; and,
FIG. 8 is a cross-sectional view thereof taken along the line VIII--VIII of FIGS. 1 and 2.
Kirschbauer, Josef, Mundigl, Josef
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 09 1994 | MUNDIGL, JOSEF | Siemens Aktiengesellschaft | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007646 | /0393 | |
Feb 09 1994 | KIRSCHBAUER, JOSEF | Siemens Aktiengesellschaft | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007646 | /0393 | |
Feb 14 1994 | Siemens Aktiengesellschaft | (assignment on the face of the patent) | / |
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