Patent
   D720354
Priority
Nov 22 2011
Filed
May 21 2012
Issued
Dec 30 2014
Expiry
Dec 30 2028
Assg.orig
Entity
unknown
16
37
n/a
The ornamental design for a module with built-in integrated circuits for use with IC card, as shown and described.

FIG. 1 is a perspective view of a module with built-in integrated circuits for use with IC card, showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a rear elevational view thereof; and,

FIG. 7 is a bottom plan view thereof.

Komatsu, Akira

Patent Priority Assignee Title
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Apr 03 2012KOMATSU, AKIRAKabushiki Kaisha ToshibaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0282420516 pdf
May 21 2012Kabushiki Kaisha Toshiba(assignment on the face of the patent)
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