Patent
   D471167
Priority
Apr 27 2001
Filed
Apr 05 2002
Issued
Mar 04 2003
Expiry
Mar 04 2017
Assg.orig
Entity
unknown
118
7
n/a
The ornamental design for a hybrid integrated circuit board, as shown and described.

FIG. 1 is a perspective view of a hybrid integrated circuit board showing an embodiment of our new design;

FIG. 2 is a front elevational view thereof, which is symmetrical to a rear elevational view not shown herein;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

Kato, Hideki, Ito, Tetsuya, Igarashi, Tomohiro, Wasada, Yoshiyuki, Ebihara, Hitoshi, Yoda, Hideki, Tomaru, Naoki

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 05 2002Taiyo Yuden Co., Ltd.(assignment on the face of the patent)
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