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The ornamental design for a hybrid integrated circuit board, as shown and described.
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FIG. 1 is a perspective view of a hybrid integrated circuit board showing an embodiment of our new design;
FIG. 2 is a front elevational view thereof, which is symmetrical to a rear elevational view not shown herein;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a bottom plan view thereof.
Kato, Hideki, Ito, Tetsuya, Igarashi, Tomohiro, Wasada, Yoshiyuki, Ebihara, Hitoshi, Yoda, Hideki, Tomaru, Naoki
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Apr 05 2002 | Taiyo Yuden Co., Ltd. | (assignment on the face of the patent) | / |
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